XTRAIA TF Series
Fab-ready XRD metrology for thin films
High-resolution, non-destructive full-wafer characterization for thin film manufacturing
The XTRAIA TF Series is Rigaku’s production-ready X-ray diffraction (XRD) platform for thin film process control in high-volume semiconductor fabs. Purpose-built for 200 mm and 300 mm wafer lines, the system provides non-destructive, high-throughput mapping of thin film properties, including crystallinity, lattice strain, stress/relaxation, thickness, and interface quality.
Available models:
- XTRAIA TF-2000: Supports wafers up to 200 mm
- XTRAIA TF-3000: Supports wafers up to 300 mm

XTRAIA TF Series Overview
Designed for power electronics, RF devices, and advanced logic, the XTRAIA TF Series helps fabs monitor deposition uniformity, assess crystallographic orientation, and control multilayer heterostructures with exceptional precision. By combining HRXRD, XRR, and reciprocal space mapping (RSM) on a single platform, it delivers inline yield assurance without requiring wafer cleaving or destructive analysis.
Engineered for 24/7 reliability, the XTRAIA TF integrates seamlessly with fab automation (SECS/GEM), ensuring stability, repeatability, and maximum throughput in demanding production environments.
The XTRAIA TF Series empowers fabs to eliminate process drift, qualify new materials, and protect yield across advanced device manufacturing. With high-speed diffraction mapping and robust wafer automation, it offers the precision of R&D instrumentation and the throughput of fab-ready metrology.
Key benefits include:
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Applications:
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XTRAIA TF Series Features
XTRAIA TF Series Specifications
Technique | X-ray diffraction (XRD), HRXRD, and XRR with full-wafer mapping | |
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Wafer sizes | 200 mm (TF-2000), 300 mm (TF-3000) | |
Measurement items | Thickness, density, roughness, crystallinity, strain, relaxation, defects | |
Detectors | HyPix-3000/400 high-speed 2D detector (optional HRXRD camera) | |
Throughput | High-speed full-wafer mapping in minimal cycle times | |
Automation | Wafer handling, recipe-driven workflows, inline SPC reporting | |
Connectivity | SECS/GEM/GEM300 compliant for fab integration | |
Non-destructive | Direct measurement on in-process wafers, no cleaving required | |
Reliability | 24/7 uptime, robust components, stable performance |
XTRAIA TF Series Events
Learn more about our products at these events
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EventDatesLocationEvent website
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EMRS Fall meeting 2025September 14 2025 - September 17 2025Warsaw, Poland
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International Conference on Silicon Carbide and Related Materials (ICSCRM 2025)September 15 2025 - September 18 2025Busan, Korea
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SEMICON JapanDecember 1 2025 - December 2 2025Tokyo, Japan

Contact Us
Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.