XTRAIA TF Series

Fab-ready XRD metrology for thin films

High-resolution, non-destructive full-wafer characterization for thin film manufacturing

The XTRAIA TF Series is Rigaku’s production-ready X-ray diffraction (XRD) platform for thin film process control in high-volume semiconductor fabs. Purpose-built for 200 mm and 300 mm wafer lines, the system provides non-destructive, high-throughput mapping of thin film properties, including crystallinity, lattice strain, stress/relaxation, thickness, and interface quality.

Available models:

  • XTRAIA TF-2000: Supports wafers up to 200 mm
  • XTRAIA TF-3000: Supports wafers up to 300 mm
XTRAIA TF Series-1

XTRAIA TF Series Overview

Designed for power electronics, RF devices, and advanced logic, the XTRAIA TF Series helps fabs monitor deposition uniformity, assess crystallographic orientation, and control multilayer heterostructures with exceptional precision. By combining HRXRD, XRR, and reciprocal space mapping (RSM) on a single platform, it delivers inline yield assurance without requiring wafer cleaving or destructive analysis.

Engineered for 24/7 reliability, the XTRAIA TF integrates seamlessly with fab automation (SECS/GEM), ensuring stability, repeatability, and maximum throughput in demanding production environments.

The XTRAIA TF Series empowers fabs to eliminate process drift, qualify new materials, and protect yield across advanced device manufacturing. With high-speed diffraction mapping and robust wafer automation, it offers the precision of R&D instrumentation and the throughput of fab-ready metrology.

Key benefits include:
  • Rapid, non-destructive full-wafer characterization
  • Inline-ready with SECS/GEM compliance
  • Recipe-driven flexibility for multiple device types
  • Fab-optimized for uptime, reliability, and automation
Applications:
  • Power devices: SiC epitaxy relaxation monitoring, thin film stress analysis
  • RF & HEMTs: AlGaN/GaN stack mapping on Si substrates
    Logic & memory: High-k/metal gate thickness and interface quality
  • Compound semiconductors: GaAs, InP, and GaN epitaxial film quality control
  • Advanced packaging: multilayer stack orientation and strain control

XTRAIA TF Series Features

Dual models: TF-2000 for 200 mm wafers, TF-3000 for 300 mm wafers
9 kW rotating anode source with high-brilliance line beam for fast mapping
HyPix-3000/400 detectors for high-speed, high-resolution diffraction imaging
Full-wafer HRXRD & XRR characterization of thickness, density, strain, relaxation, and roughness
Crystallographic orientation monitoring (e.g., GaAs(004), cubic GaN(002), hexagonal GaN(0004))
Multi-layer stack analysis for HEMTs, RF devices, high-k/metal gate stacks, and LEDs
Process-ready automation: wafer handling, recipe management, inline statistical reporting

XTRAIA TF Series Specifications

Technique X-ray diffraction (XRD), HRXRD, and XRR with full-wafer mapping
Wafer sizes 200 mm (TF-2000), 300 mm (TF-3000)
Measurement items Thickness, density, roughness, crystallinity, strain, relaxation, defects
Detectors HyPix-3000/400 high-speed 2D detector (optional HRXRD camera)
Throughput High-speed full-wafer mapping in minimal cycle times
Automation Wafer handling, recipe-driven workflows, inline SPC reporting
Connectivity SECS/GEM/GEM300 compliant for fab integration
Non-destructive Direct measurement on in-process wafers, no cleaving required
Reliability 24/7 uptime, robust components, stable performance

XTRAIA TF Series Events

Learn more about our products at these events

  • EMRS Fall meeting 2025
    September 14 2025 - September 17 2025
    Warsaw, Poland
  • International Conference on Silicon Carbide and Related Materials (ICSCRM 2025) 
    September 15 2025 - September 18 2025
    Busan, Korea
  • SEMICON Japan
    December 1 2025 - December 2 2025
    Tokyo, Japan

Contact Us

Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.