Photomask & lithography challenges

As chip features shrink and materials grow more complex, the pressure on photomask integrity and lithography precision has never been greater. For manufacturers working with extreme ultraviolet (EUV) masks and high-aspect-ratio structures, the margin for error is razor thin, demanding tools that can keep pace with next-generation challenges.

Rigaku’s Advanced X-ray Metrology Suite is designed with this reality in mind. Whether you're evaluating contamination, measuring multilayer stacks, profiling nanostructures, or mapping full wafers, each tool in the suite is built to deliver the clarity and consistency modern fabs require. It’s a smarter, more integrated way to elevate accuracy at every stage of the lithography process, non-destructively, reliably, and with the throughput today’s production environments demand.

Our Advanced X-ray Metrology Suite is purpose-built to meet the demands of today’s most advanced lithography processes. From surface contamination analysis to multilayer thickness measurement, nanostructure profiling, and full-wafer mapping, each tool is engineered to deliver accurate, repeatable, and non-destructive insights across every process node.

Download Brochure