XTRAIA TF Series

Fab-ready XRD metrology for thin films

High-resolution, non-destructive full-wafer characterization for thin film manufacturing

The XTRAIA TF Series is Rigaku’s production-ready X-ray diffraction (XRD) platform for thin film process control in high-volume semiconductor fabs. Purpose-built for 200 mm and 300 mm wafer lines, the system provides non-destructive, high-throughput mapping of thin film properties, including crystallinity, lattice strain, stress/relaxation, thickness, and interface quality.

Available models:

  • XTRAIA TF-2000: Supports wafers up to 200 mm
  • XTRAIA TF-3000: Supports wafers up to 300 mm
XTRAIA TF Series-1

XTRAIA TF Series Overview

Designed for power electronics, RF devices, and advanced logic, the XTRAIA TF Series helps fabs monitor deposition uniformity, assess crystallographic orientation, and control multilayer heterostructures with exceptional precision. By combining HRXRD, XRR, and reciprocal space mapping (RSM) on a single platform, it delivers in-line yield assurance without requiring wafer cleaving or destructive analysis.

Engineered for 24/7 reliability, the XTRAIA TF integrates seamlessly with fab automation (SECS/GEM), ensuring stability, repeatability, and maximum throughput in demanding production environments.

The XTRAIA TF Series empowers fabs to eliminate process drift, qualify new materials, and protect yield across advanced device manufacturing. With high-speed diffraction mapping and robust wafer automation, it offers the precision of R&D instrumentation and the throughput of fab-ready metrology.

Key benefits include:
  • Rapid, non-destructive full-wafer characterization
  • In-line-ready with SECS/GEM compliance
  • Recipe-driven flexibility for multiple device types
  • Fab-optimized for uptime, reliability, and automation
Applications:
  • Power devices: SiC epitaxy relaxation monitoring, thin film stress analysis
  • RF & HEMTs: AlGaN/GaN stack mapping on Si substrates
    Logic & memory: High-k/metal gate thickness and interface quality
  • Compound semiconductors: GaAs, InP, and GaN epitaxial film quality control
  • Advanced packaging: multilayer stack orientation and strain control

XTRAIA TF Series Features

Dual models: TF-2000 for 200 mm wafers, TF-3000 for 300 mm wafers
9 kW rotating anode source with high-brilliance line beam for fast mapping
HyPix-3000/400 detectors for high-speed, high-resolution diffraction imaging
Full-wafer HRXRD & XRR characterization of thickness, density, strain, relaxation, and roughness
Crystallographic orientation monitoring (e.g., GaAs(004), cubic GaN(002), hexagonal GaN(0004))
Multi-layer stack analysis for HEMTs, RF devices, high-k/metal gate stacks, and LEDs
Process-ready automation: wafer handling, recipe management, in-line statistical reporting

XTRAIA TF Series Specifications

Technique X-ray diffraction (XRD), HRXRD, and XRR with full-wafer mapping
Wafer sizes 200 mm (TF-2000), 300 mm (TF-3000)
Measurement items Thickness, density, roughness, crystallinity, strain, relaxation, defects
Detectors HyPix-3000/400 high-speed 2D detector (optional HRXRD camera)
Throughput High-speed full-wafer mapping in minimal cycle times
Automation Wafer handling, recipe-driven workflows, in-line SPC reporting
Connectivity SECS/GEM/GEM300 compliant for fab integration
Non-destructive Direct measurement on in-process wafers, no cleaving required
Reliability 24/7 uptime, robust components, stable performance

XTRAIA TF Series Events

Learn more about our products at these events

  • Rigaku Taiwan professional training courses (XRD)
    January 23 2026 - January 23 2026
    Rigaku Taiwan (RTC-TW)
  • Rigaku School for Practical Crystallography
    January 26 2026 - February 6 2026
  • SEMICON Korea 2026
    February 11 2026 - February 13 2026
    COEX, South Korea
  • SPIE Advanced Lithography + Patterning
    February 22 2026 - February 26 2026
    San Jose, CA, USA 
  • Florida Semiconductor Summit
    February 23 2026 - February 25 2026
    Orlando, FL, USA
  • Rigaku Taiwan professional training courses (SCX)
    February 26 2026 - February 26 2026
    Rigaku Taiwan (RTC-TW)
  • Applied Physics Society Autumn Nagoya
    March 15 2026 - March 16 2026
    Tokyo, Japan
  • The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum Sponsors
    March 16 2026 - March 19 2026
     Monterey, CA ,USA
  • SEMICON China 2026
    March 25 2026 - March 27 2026
    SNIEC, Shanghai, China
  • Rigaku Taiwan professional training courses (XRD)
    March 27 2026 - March 27 2026
    Rigaku Taiwan (RTC-TW)
  • CS International 2026
    April 20 2026 - April 22 2026
    Brussels, Belgium
  • SEMICON SEA 2026
    May 5 2026 - May 7 2026
    Kuala Lumpur, Malaysia
  • ASMC – Advanced Semiconductor Manufacturing Conference
    May 11 2026 - May 14 2026
    Albany, NY, USA
  • The 2026 IEEE 76th Electronic Components and Technology Conference
    May 26 2026 - May 29 2026
    Orlando, Fl, USA
  • CEIA Leti Innovation Days
    June 23 2026 - June 25 2026
    Maison Minatec, Grenoble, France 
  • The International Workshop on Gallium Oxide and Related Materials (IWGO-6)
    August 2 2026 - August 7 2026
     College Park, MD, USA.
  • SEMICON Taiwan 2026
    September 2 2026 - September 4 2026
    Taipei, Taiwan
  • ICSCRM Japan 2026 (Silver Sponsor)
    September 27 2026 - October 2 2026
    Yokohama, Japan
  • SEMICON West 2026
    October 13 2026 - October 15 2026
    San Francisco, CA, USA 
  • SEMICON Europa
    November 10 2026 - November 13 2026
    Munich, Germany
  • SEMICON Japan 2026
    December 9 2026 - December 11 2026
    Tokyo, Japan

Contact Us

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