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Rigaku at SEMICON China 2026

Advanced X-ray metrology solutions for semiconductor manufacturing

At SEMICON China, Rigaku will showcase advanced X-ray analytical technologies supporting semiconductor R&D, process development, contamination control, and high-volume manufacturing.

From ultra-trace contamination detection to complex thin film and structural analysis, our solutions enable precision, reliability, and yield protection across the semiconductor value chain.

Semiconductor manufacturing process coverage

A complete view of the Semiconductor Value Chain

Our Semiconductor Process Map illustrates how Rigaku X-ray metrology solutions support:

Surface contamination control

TXRF Series

Ultra-trace surface contamination analysis designed for advanced fabs.

Applications include:
Metallic contamination monitoring

Tool qualification

Incoming wafer inspection

Root cause analysis

Non-destructive measurement with high sensitivity ensures contamination control at advanced nodes.

SEMICON China product lineup

Thin film & structural metrology

XTRAIA MF-3400 (1200 x 627)
XTRAIA MF-3400

Non-destructive thin film and multi-layer structure analysis.

Enables:

  • • Film thickness measurement
  • • Composition analysis
  • • Multi-layer stack characterization
  • • Process monitoring and control

Learn more >
XTRAIA XD-3300 (1200 x 627)
XTRAIA XD-3300

High-precision structural and compositional analysis for complex semiconductor architectures.

Ideal for:

  • • Advanced device structures
  • • Multi-layer thin films
  • • Packaging materials
  • • Emerging semiconductor materials

Learn more >

Elemental & materials characterization

WDXRF Series

High-accuracy elemental analysis for semiconductor materials and compound semiconductor applications.
Superior spectral resolution

Accurate quantification

Long-term analytical stability

Supports raw material verification and materials development. Exceptional precision and accuracy in measuring the thickness and composition of materials, particularly with light elements.

Hybrid metrology tools

In-line dual-head micro-spot XRF

ONYX 3200

EDXRF and optical hybrid metrology tool for automated X-ray analysis, 3D scanning, and 2D microscope for film thickness and composition measurements on blanket and patterned wafers for up to 300 mm wafers 

  • High-performance in-line dual-head micro-spot XRF
  • Non-destructive wafer inspection and metrology
  • Dual X-ray source (polycapillary / monochromatic)
  • For up to 300 mm wafers.
Learn More
ONYX 3200

Plan your visit

Experience these solutions at SEMICON China

Rigaku technologies will be presented in collaboration with our authorized distribution partners in China. Our specialists will be available to discuss application-specific challenges and demonstrate how X-ray metrology enhances process control and yield performance.

You are invited to meet our teams at:

Contact Us

Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.

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