TFXRD Near Fab

The TFXRD Near-Fab is Rigaku’s versatile thin film X-ray diffraction system, engineered to bring high-resolution structural analysis directly into production environments. Designed for use near semiconductor fabrication lines, it enables rapid, non-destructive evaluation of epitaxial layers, thin film stacks, and multilayer heterostructures on wafers up to 300 mm.​

With a compact, cleanroom-compatible footprint, automated wafer handling, and recipe-based operation, the TFXRD Near-Fab streamlines the transition from research and development (R&D) to pilot and high-volume manufacturing. It delivers precise measurements of lattice strain, crystal quality, layer thickness,  composition, and orientation to support process qualification, early defect detection, and yield optimization.​

By combining lab-grade accuracy with fab-level throughput, the TFXRD-300 ensures reliable monitoring and control of advanced thin film processes for power,  RF, MEMS, and logic device production.​

Pre-production & pilot lines (TFXRD Near-Fab)​

• Recipe transfer from lab to fab environments​
• Process qualification for new device architectures​
• Semi-automated wafer characterization to support pilot runs​
• Evaluation of defect density and layer uniformity before scale-up​
• Early-stage monitoring of high-k/metal gate stacks and advanced dielectrics​