Rigaku Technology Center Silicon Valley (RTC-SV)
We are contributing to the enhancement of humanity through scientific and technological development
Cutting-edge semiconductor metrology for semiconductor R&D and high-volume manufacturing
✓ Applications Training
✓ Metrology Tools Demonstrations
✓ Application Development
✓ Service Training
✓ Experience the latest thin fillm inspection, metrology, and monitoring technologies
How can we help?
X-ray fluorescence techniques for blanket thin film and patterned device measurements, high-resolution X-ray techniques for epitaxy, strain, and crystal structure, and capabilities for monitoring process contamination. From a technology perspective, these capabilities cover advanced process development and manufacturing from front-end patterning through deposition/etch through packaging.
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Capabilities and technologies
Experience advanced 300 mm X-ray metrology instrumentation. The most reliable solutions to aid their metrology issues keep growing over the device generations, with the highest throughput and compelling cost of ownership.
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Applications and service
Training is as important to you as it is to us. We want to be sure everyone on your team is adequately trained on the safety and operation of our X-ray metrology tools.
R&D facility location
At the new Rigaku Technology Center, visitors will experience the most reliable solutions to address their metrology challenges and keep developing over the device generations, with the highest throughput and compelling cost of ownership. Including:
TXRF (Total Reflection X-ray Fluorescence) | Typically for surface contamination) TXRF 3800e, TXRF 3760, TXRF310Fab, TXRF-V310, XHEMIS TX-3000, and XHEMIS TX-3000V.
WDXRF (Wavelength Dispersive X-ray Fluorescence) | Typically for highly accurate and precise thickness and composition measurements, especially with light elements. AZX 400, WDA-3650, and WaferX 310.
Hybrid EDXRF (Energy Dispersive X-ray Fluorescence) and Optical Techniques) | Typically for characterization of multilayered samples for BEOL and packaging applications. It combines micro-spot ED-XRF, 2D microscope, and 3D scanner for In-line non-destructive inspection and metrology. ONYX 3000 and ONYX 3200.
EDXRF (Energy-Dispersive X-ray Fluorescence), XRR (X-ray Reflectivity), and XRD (X-ray Diffraction) | The combination of X-ray techniques supports a wide range of applications typically for the characterization of ultra-thin, multi-layer samples, blanket, and patterned samples. XTRAIA® MF-2000 and XTRAIA® MF-3000.
HR-XRD (High-Resolution X-Ray Diffraction) and XRR | Strain, composition, and thickness of epitaxial layers, crystalline phase, and texture of polycrystalline films. Thin film and film stack thicknesses and density. XTRAIA® XD-3200 and XTRAIA® XD-3300.
*Tools listed in bold italic are on display
Per the continual demand of the semiconductor industry, integrated circuits (ICs) demonstrate higher performance at a lower cost than their predecessors. Wafer metrology tools are used to design and manufacture ICs by carefully controlling the film properties, line widths, and potential defect levels to optimize the manufacturing process of these devices. Rigaku’s metrology tools and wafer inspection capabilities can target semiconductor devices' physical and electrical properties under production. Wafer metrology can specifically identify surface particles, pattern flaws, and other conditions that could negatively impact device performance.
Rigaku is constantly developing new technologies for:
- Metrology Automation, Thin Film Characterization.
- Wafer Contamination Monitoring.
- Ultra-thin single-layer films and multi-layer stacks.
- Non-Destructive 3D Measurement Technology.
- Semiconductor High-Volume Manufacturing Process Monitoring from Lab to Fab.
