Rigaku Technology Center Silicon Valley

TXRF (Total Reflection X-ray Fluorescence) | Typically for surface contamination) TXRF 3760, TXRF 310Fab, TXRF-V310, XHEMIS TX-3000, and XHEMIS TX-3000V.   

WDXRF (Wavelength Dispersive X-ray Fluorescence) | Typically for highly accurate and precise thickness and composition measurements, especially with light elements. AZX 400, WDA-3650, and WaferX 310. 

Hybrid EDXRF (Energy Dispersive X-ray Fluorescence and Optical Techniques)  | Typically for characterization of multilayered samples for BEOL and packaging applications. It combines micro-spot EDXRF, 2D microscope, and 3D scanner for In-line non-destructive inspection and metrology. ONYX 3000 and ONYX 3200.

EDXRF (Energy Dispersive X-ray Fluorescence), XRR (X-ray Reflectometry), and XRD (X-ray Diffraction) | The combination of X-ray techniques supports a wide range of applications typically for the characterization of ultra-thin, multi-layer samples, blanket, and patterned samples. XTRAIA MF-2000 and XTRAIA MF-3000.

HRXRD (High-resolution X-ray Diffraction) and XRR | Strain, composition, and thickness of epitaxial layers, crystalline phase, and texture of polycrystalline films. Thin film and film stack thicknesses and density. XTRAIA XD-3200 and XTRAIA XD-3300.

*Tools listed in bold italic are on display

Per the continual demand of the semiconductor industry, integrated circuits (ICs) demonstrate higher performance at a lower cost than their predecessors. Wafer metrology tools are used to design and manufacture ICs by carefully controlling the film properties, line widths, and potential defect levels to optimize the manufacturing process of these devices. Rigaku’s metrology tools and wafer inspection capabilities can target semiconductor devices' physical and electrical properties under production. Wafer metrology can specifically identify surface particles, pattern flaws, and other conditions that could negatively impact device performance.