半导体
从实验室到晶圆厂的 X 射线计量解决方案
半导体蕴含着推动世界进步的力量。作为全球领先的半导体工艺研发与大规模制造X射线计量设备供应商,理学正致力于将这一愿景转变为现实。
凭借超过七十年的全球市场领导地位,理学公司始终是X射线技术仪器领域的领军制造商,致力于解决半导体研发与生产中的制造难题。我们先进的系列产品为全产业链提供解决方案——从晶圆厂内工艺控制计量,到薄膜与材料表征的研发需求,全面覆盖产业关键环节。
为半导体制造工艺的质量与可靠性保驾护航
理学半导体 X 射线计量工具旨在为半导体研发和大规模制造提供最先进、最可靠的解决方案。我们采用 TXRF、WDXRF、EDXRF、XRR、HRXRD 和 CDSAXS 等尖端技术,确保测量结果具备卓越的质量和精度。通过X 射线衍射(XRD)、X 射线荧光光谱(XRF)、X 射线反射率(XRR)和 X 射线形貌术(XRT)等计量设备,可精准测量薄膜厚度、成分、粗糙度、密度、孔隙率及晶体结构缺陷等关键工艺参数。我们还提供全反射-X射线荧光光谱及气相分解-全反射X射线荧光光谱等污染检测专用工具,实现痕量污染物分析。
依托全球全天候服务和技术支持,理学致力于为客户提供提升良率与优化工艺的前沿解决方案。选择理学,以前所未有的计量技术引领产业变革,始终保持竞争优势。
应用说明
以下是与该行业相关的应用说明
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WDXRF1092 - Fixed Angle Measurement using the Semi-Quantitative Analysis Function SQX of ZSX Guidance Software
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WDXRF1063 - Thickness/composition of ITO Thin Film by FP Method
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RSMD010 - Metrology for Substrate Back Side Contamination
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RSMD009 - Metrology for MTJ Layer Thickness & Composition
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RSMD008 - Metrology for MRAM Layer Thickness, Density & Roughness
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RSMD007 - Single Wafer Pass Detection & Metrology
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RSMD006 - Thickness and Composition of Piezoelectric PZT Films
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RSMD005 - Surface Contamination of SiC, GaN Power Device Wafers
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RSMD004 - Pd Measurement on GaAs Wafer
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RSMD003 - WDXRF Composition Mapping of a PZT Sputtering Target
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RSMD002 - Thickness Characterization of a Power Device Backside Electrode
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RSMD001 - Evaluation Of Wet Cleans In SiC Power MOSFET Fabrication By TXRF
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EDXRF1054 - SiO₂, AlSi, Ti, TiN, Pt, AlCu, and BPSG on Silicon
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B-XRD3005 - Evaluation of Residual Stress of Thin Films by GI-XRD and the Multiple hkl Method
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B-XRD2038 - Full-wafer Mapping Evaluation of Metal Films on an 8-inch Wafer using the Rθ Attachment
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B-XRD2037 - Evaluation of Native Oxide Film on Larger-diameter Silicon Substrates Using High-precision Thin Film XRD for Advanced Research
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B-XRD2034 - Twist Width Evaluation of Group III-V Nitride Films by Rocking Curve Measurement
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B-XRD2031 - Evaluation of Curvature of a Single Crystal Substrate by Rocking Curve Measurement
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B-XRD2030 - Evaluation of Uniformity of Thin Film Thickness by X-ray Reflectivity Mapping
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B-XRD2028 - Off-normal Fiber Texture Analysis by Pole Figure Measurement
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B-XRD2027 - Evaluation of Uniformity of a Single Crystal Substrate by Rocking Curve Measurement
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B-XRD2026 - Analysis of Epitaxial Films on In-plane Anisotropic Substrates by Wide-Range RSM
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B-XRD2025 - Analysis of Uniaxially Oriented Film by Wide-range RSM
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B-XRD2024 - High-speed RSM of a III-nitride Epitaxial Film by 1D Detection Mode
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B-XRD2023 - Phase Identification of an Organic Thin Film by GIWAXS Measurement with a 2D detector
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B-XRD2022 - Crystal Defect Analysis by X-ray Reflection Topography
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B-XRD2021 - High-speed RSM of an Epitaxial Film by 1D Detection Mode
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B-XRD2009 - Orientation Analysis of Organic Thin Film on Single Crystal Sub by In-plane XRD
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B-XRD2007 - Examination for Growth Process of Organic Thin Film by In-plane XRD
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B-XRD2005 - Orientation Analysis of Organic Thin Film on Rubbed Glass by In-plane XRD
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B-XRD2001 - Evaluation of Crystal Quality (Tilt and Twist Qidths) of Group-III Nitride Film by the Rocking Curve Method
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B-XRD1139 - Calculation of Molecular Stacking Spacing of Copper Phthalocyanine using PDF Analysis
产品
XTRAIA MF-3400
Multi-functional XRR / XRD / XRF metrology system for thin-film analysis and process control for patterned wafer up to 300 mm.
了解更多XTRAIA MF-2000
集成XRR、EDXRF和XRD的计量工具:EDXRF用于测量薄膜成分与厚度;XRR用于测量薄膜厚度、密度与粗糙度;适用于最大200毫米晶圆的图案化与非图案化薄膜
了解更多XHEMIS TX-2000
Next-generation total-reflection XRF system for surface-metal control in semiconductor fabs for wafers up to 200 mm
了解更多TFXRD Lab
高分辨率X射线衍射(HRXRD)与X射线反射(XRR)系统,可实现非图案化外延薄膜的厚度、密度、表面/界面粗糙度、成分分布、应变、弛豫状态及倒易空间映射(RSM)的多维度表征。系统具备全晶圆映射能力,可覆盖直径达300mm的晶圆,适用于半导体制造的近厂(Near-Fab)应用场景。
了解更多TFXRD Near Fab
高分辨率X射线衍射(HRXRD)与X射线反射(XRR)系统,可实现非图案化外延薄膜的厚度、密度、表面/界面粗糙度、成分分布、应变、弛豫状态及倒易空间映射(RSM)的多维度表征。系统具备全晶圆映射能力,可覆盖直径达200mm的晶圆,适用于半导体制造的近厂(Near-Fab)应用场景。
了解更多XTRAIA XD-2000R
Non-destructive X-ray reflectometry metrology tool for multilayer films, EUV masks, and advanced thin-film applications.
了解更多XRTmicron (Lab)
X射线形貌(XRT)成像系统,可针对功率电子、光电子及5G/6G通信领域的核心半导体材料(碳化硅(SiC)、氮化镓(GaN)、砷化镓(GaAs)、磷化铟(InP)、氧化镓(Ga₂O₃))开展单晶缺陷可视化表征,支持直径达300mm的晶圆测试。
了解更多XTRAIA XT Series (Fab)
High-resolution, non-destructive wafer defect visualization for semiconductor manufacturing
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