XTRAIA XT Series (Fab)

Engineered for both R&D and high-volume manufacturing, the XTRAIA XT Series integrates seamlessly with fab workflows. Its cleanroom-ready design ensures compatibility with stringent contamination control requirements, while its automation capabilities—covering alignment, optics switching, and image acquisition—reduce operator workload and variability. Whether applied to silicon or advanced compound semiconductors (SiC, GaN, InP, GaAs, AlN, Ga₂O₃), the XTRAIA XT Series provides the resolution and repeatability required for advanced memory, logic, power, photonics, RF, and sensor applications.

The XTRAIA XT Series empowers semiconductor fabs to visualize dislocations, slip lines, and other crystallographic defects that threaten device performance. Built for full-wafer evaluation up to 300 mm, it ensures scalable yield management from lab to fab. Key benefits include:

• High-resolution, high-speed full-wafer imaging
• Non-destructive measurement with minimized particle or metal contamination
• Automation-ready system for inline QC and R&D flexibility
• Wide material compatibility (Si, SiC, GaN, InP, GaAs, AlN, Ga₂O₃)
• SEMI S2/S8 compliant
• SECS/GEM and GEM300 compliant