XRTmicron Lab

X-ray topography imaging system

For non-destructive evaluation of single-crystalline materials

Rigaku XRTmicron is a fast, high-resolution laboratory X-ray topography system for non-destructive crystal defect imaging. Various types of dislocations, micropipes, stacking faults, small angle grain boundaries, and non-uniformity within single crystal wafers (such as Si, SiC, GaN, InP, GaAs, AlN, Ga₂O₃, sapphire, and more) can be imaged across wafers up to 300 mm in diameter. 

XRTmicron system doors closed XTRAIA XT Series image 2

XRTmicron Lab Overview

The XRTmicron Lab is designed for scientists conducting fundamental research in crystal growth and epitaxial layer formation. By providing high-resolution, non-destructive X-ray topography, it enables researchers to study the underlying physics of crystallographic defects and explore the mechanisms that govern material quality.

This system supports manual sample handling, from coupons to 300 mm wafers, with flexible configuration, aligns with the needs of laboratory environments, allowing scientists to design experiments, validate growth processes, and investigate defect formation at the earliest stages.

With the XRTmicron Lab, researchers can push the boundaries of material science, gaining insights that not only advance academic knowledge and material discovery but also lay the groundwork for new applications in power electronics, optoelectronics, and beyond.

XRTmicron Lab Features

Broad sample compatibility
Supports coupons, full wafers, epitaxial stacks on wafers, and crystal ingots/boules. Samples up to Φ300 mm
High brilliance
Dual-wavelength MicroMax-007 source with parabolic multilayer optics
Detector suite
XTOP (5.4 µm/pixel), HR-XTOP (2.4 µm/pixel, optional), and HyPix-3000HE (100 µm/pixel, high-speed)
Sample placement considering minimization of external forces
Horizontal sample stage minimizes artificial strain in wafers
Image quality assurance
Automatic wafer curvature correction for optimal defect visualization
Automated operation
Alignment, optics/detector switching, and image collection all controlled automatically
Advanced analysis
Automated dislocation mapping and quantification for faster results

XRTmicron Lab Specifications

Technique X-ray topograph imaging
Purpose Non-destructive evaluation of single-crystalline materials
Technology Switch between transmission and reflection topography
Key components High-brightness micro X-ray source; specialized X-ray mirror optics; high-resolution, high-sensitivity X-ray camera
Options HR-XTOP camera, Crystal collimator, ​Defect inspection done with XRT Toolbox Software
Wafer transfer / Sample handling Manual handling

XRTmicron Lab Resources

Webinars

Investigating Crystalline Defects of Semiconductors Using X-ray Topography Watch the Recording
Non-Destructive Dislocation Characterization in SiC Substrates Using XRTmicron Technology Watch the Recording

Rigaku Journal articles

adobeCrystal defects in SiC wafers and a new X-ray topography system Read the Article
adobeHigh-throughput, high-resolution X-ray topography imaging system: XRTmicron Read the Article
adobeNon-destructive characterization of crystallographic defects of SiC substrates using X-ray topography for R&D and quality assurance in production Read the Article
adobeDefect structure analysis in single crystal substrates using XRTmicron Read the Article
adobeDramatic improvement in the throughput of X-ray topography Read the Article

Publications

XRTmicron Lab Events

Learn more about our products at these events

  • EMRS Fall meeting 2025
    September 14 2025 - September 17 2025
    Warsaw, Poland
  • International Conference on Silicon Carbide and Related Materials (ICSCRM 2025) 
    September 15 2025 - September 18 2025
    Busan, Korea
  • SEMICON Japan
    December 1 2025 - December 2 2025
    Tokyo, Japan

Contact Us

Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.