XRTmicron Near-Fab

The XRTmicron Near-Fab is designed for semiconductor manufacturers who require a flexible evaluation system that works across both R&D environments, pilot production lines, and high-volume production. Positioned between the Lab and Fab configurations, it combines research-level precision with the automation and reliability needed for process integration and quality control.

Supporting wafers up to 300 mm, the Near-Fab system offers both manual and automated wafer transfer, making it ideal for fabs in transition—from early material studies to process qualification and inline quality monitoring. Its non-destructive, high-resolution imaging provides detailed visualization of dislocations, slip lines, and other crystallographic defects that directly impact device yield and reliability.

With SEMI-compliant defect analysis software, the XRTmicron Near-Fab enables engineers to bridge the gap between discovery and high-volume manufacturing, ensuring that materials and processes are production-ready.

Applications

1. SiC for power devices: TSD and BPD mapping (SEMI M91/M93 compliant)
2. GaN & AlN for RF, optoelectronics and power devices: Process development and quality control
3. InP & GaAs for VCSEL and photonics: defect mapping on substrate and epi-level
4. Ga₂O₃ for power devices: Substrate and epitaxy quality improvement
5. Al₂O₃ as optoelectronic substrates: process improvement and quality control
6. Si/SiGe superlattices for 3D-DRAM and advanced logic structures: Process development and misfit dislocation detection