XTRAIA MF-3400

Fourth generation high-speed, high-precision X-ray metrology 

Multifunctional XRR / XRD / XRF metrology system for thin-film analysis and process control for patterned wafer up to 300 mm

The XTRAIA MF-3400 introduces the fourth generation (Gen 4) of Rigaku’s multifunctional thin-film metrology platform, combining XRR, XRD, and XRF technologies in a single high-throughput, high-precision system. 

Designed for demanding semiconductor environments, the MF-3400 delivers superior measurement speed, accuracy, and uptime, driven by innovations in X-ray source intensity, robotic precision, and automated system control. 

Its newly developed high-intensity Cu tube provides twice the XRF intensity for improved sensitivity, while the real-time monitored robotic arm achieves unprecedented repeatability. Together with advanced software and fault-tolerant mechanical systems, the MF-3400 ensures robust, repeatable results for high-volume production lines. 

XTRAIA MF-3400

XTRAIA MF-3400 Overview

The XTRAIA MF-3400 is engineered for thin-film metrology across XRR, XRD, and XRF modes. It provides high-precision measurement of layer thickness, density, and composition, with faster analysis cycles for semiconductor wafer characterization. 

This new system builds on the proven strengths of the previous generation, now featuring an X-ray source with nearly double the intensity and a redesigned transfer mechanism for faster, more precise handling. Advanced automation functions, such as search-less autofocus, real-time transfer-arm position control, and automatic FOUP door closing, ensure seamless operation, reduced downtime, and exceptional stability in cleanroom environments.

  • Over 40 % faster throughput than the previous generation.
  • Repeatability improved from ±0.1 mm → ±0.04 mm 
  • Dual-intensity Cu X-ray tube – 2× higher XRF intensity 
  • Search-less autofocus and real-time position monitoring 
  • FOUP door close & fault-tolerant FFU for reliability 

XTRAIA MF-3400 Features

Maintaining the proven functional advantages of the MF-3000 series, now enhanced with the following new features:
High-throughput measurement
> 40 % faster than Gen 3 tools
Continuous auto-adjustment system
Minimizes downtime during X-ray tube replacement
High-precision robotics
Repeatability improved from ±0.1 mm → ±0.04 mm with real-time monitoring
FOUP door close function
Automatically protects wafers during power loss or emergency events
High-intensity Cu X-ray tube
Approx. 2× higher XRF intensity for enhanced precision and speed
Fault-tolerant FFU
Redundant fans maintain clean operation if one fails, ensuring uninterrupted throughput
FP software method
Simultaneous thickness and composition analysis across a wide range of film types and multilayers
Search-less autofocus
Eliminates search time and reduces overall measurement cycle time
Integrated FDC and RMS
Health check and recipe management functions for process traceability and control

XTRAIA MF-3400 Specifications

Technique X-ray reflectivity (XRR), X-ray diffraction (XRD), and X-ray fluorescence (XRF) 
Detector type  HyPix 3000 for XRR/XRD • SDD for XRF 
X-ray source  High-power Cu tube (Gen 4) – 2× higher intensity vs. previous generation 
Repeatability  ±0.04 mm (Improved from ±0.1 mm) 
Sample compatibility  Semiconductor wafers (≤ 200 mm and 300 mm configurations) 

XTRAIA MF-3400 Options

  1. Alternative X-ray tube configurations for application flexibility 
  2. Multilayer analysis software packages (extended FP module) 
  3. Cleanroom integration kits and robotic interfaces 

The following accessories are available for this product:

XTRAIA MF-3400 Events

Learn more about our products at these events

  • AsCA 2025
    November 30 2025 - December 5 2025
    Taipei, Taiwan
  • SEMICON Japan 2025
    December 16 2025 - December 18 2025
    Tokyo, Japan

Contact Us

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