XTRAIA MF-2000

Designed for high-volume manufacturing

The XTRAIA MF-2000 is designed with high-volume 200 mm (and smaller wafer) manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and SEMI S2/S8 Compliance for semiconductor production clean room operation, SECS/GEM, high-reliability machine performance and low power consumption and cost of ownership. Available with open cassette and SMIF pod configurations.

Film thickness and density monitor

The XTRAIA MF-2000 is equipped with a HyPix 3000, two-dimensional, direct photon-counting detector for XRR and XRD measurements with multiple modes (0D, 1D, 2D) of operation. This detector has ~300,000 pixels with a 100 µm x 100 µm pixel size. When an X-ray photon is an incident, each pixel sensor becomes conductive and can count the number of incident photons one by one.

XRR detection is five times faster

High resolution and high dynamic range (10⁸) enable XRR to characterize a wide range of film thicknesses, from ultra-thin film (sub-nm) to thick film (450 nm)

Using a two-dimensional detector and X-ray reflectivity (XRR) measurement, the measurement speed of the XTRAIA MF-2000 has been improved five times compared with the conventional model.

Microcrystalline thin films with low crystallinity

In addition, XRR and X-ray diffraction (XRD) capability enable the measurement of very thin and low-crystallinity films, for which the demand is increasing.

COLORS enabling technology

Rigaku developed COLORS X-ray optics for the XTRAIA MF-2000, enabling measurements from small areas. COLORS beam modules couple X-ray tube sources with optimized optics to provide monochromatic, high-brightness illumination in small spots for various thin film applications. With its own X‑ray optics business, Rigaku is well-positioned to develop and manufacture X-ray sources for current and future market needs.

Front of line applications

• XRR/XRF combo measurement of SiGe composition in fin gate
• Thickness measurement of ultrathin films down to 1 nm
• Multilayer dielectric film measurement
• SiGe, CoSiₓ, NiSiₓ, SOl, Al, SiON, Hi-k dielectric/ metal gate

End of line applications

• Ultrathin lanthanum film measurement
• Cu seed, Cu barrier, Cu plating, Ti/TiN, Ta/TaN, W

Other applications

• XRF measurement of thickness variation in MRAM process
• XRR measurement of physical characteristics in MTJ stack
• MgO, CoFeB, Ru, Pt, PZT