XHEMIS TX-2000
Next-generation total reflection X-ray fluorescence system for surface-metal control in semiconductor fabs for wafers up to 200 mm
The XHEMIS TX-2000 is the successor to Rigaku’s proven TXRF 3760, redesigned to meet the latest SEMI, EMC, and UL standards while introducing advanced automation, digital control, and machine-learning capabilities. Building on more than two decades of field-proven reliability, the TX-2000 delivers higher safety, stability, and analytical performance for contamination control in modern semiconductor fabs. With transparent-wafer compatibility, an integrated FFU for clean wafer transfer, and fully digitalized utilities, it extends the legacy of the TXRF 3760 into a smarter, more robust platform for next-generation Si, SiC, and GaN manufacturing environments.
XHEMIS TX-2000 Overview
The Rigaku XHEMIS TX-2000 represents the evolution of the industry-proven TXRF 3760 platform, engineered to meet the latest SEMI, EMC, and UL safety standards while enhancing throughput, automation, and data intelligence.
Designed for 200 mm wafer fabs, TX-2000 delivers in-line, non-destructive quantification of ultra-trace metallic contaminants on wafer surfaces, empowering fabs to achieve tighter process control and yield optimization across SiC, GaN, and Si device manufacturing.
With integrated safety PLC monitoring, improved ergonomics, digitalized utilities, and optional machine-learning spectral prediction, the TX-2000 ensures robust fab operation with minimal downtime and maximum operator confidence.
XHEMIS TX-2000 Features
XHEMIS TX-2000 Specifications
| Technique | Total reflection X-ray fluorescence (TXRF) | |
|---|---|---|
| Measurement items | Ultratrace metal contaminants on wafer surfaces | |
| Sample compatibility | Si, SiC, GaN, glass, sapphire; up to 200 mm wafers | |
| Compliance | SEMI S2-0821 / S8-0218 / S14-1016 / EN 60204-1:2018 / UL 508A 3rd / SEMI F47 | |
| Footprint | Approx. 1050 mm H × 1025 mm W × 229 mm D (compact fab-fit design) | |
| Power | 200 V AC (DC24 V control system) | |
XHEMIS TX-2000 Application Notes
The following application notes are relevant to this product
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RSMD005 - Surface Contamination of SiC, GaN Power Device Wafers
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RSMD001 - Evaluation Of Wet Cleans In SiC Power MOSFET Fabrication By TXRF
XHEMIS TX-2000 Resources
Webinars
| Total Reflection X-ray Fluorescence (TXRF) for Semiconductor Manufacturing | Watch the Recording |
Rigaku Journal articles
| Read the Article | |
| Read the Article |
XHEMIS TX-2000 Events
XHEMIS TX-2000
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