XHEMIS TX-2000

Next-generation total reflection X-ray fluorescence system for surface-metal control in semiconductor fabs for wafers up to 200 mm

The XHEMIS TX-2000 is the successor to Rigaku’s proven TXRF 3760, redesigned to meet the latest SEMI, EMC, and UL standards while introducing advanced automation, digital control, and machine-learning capabilities. Building on more than two decades of field-proven reliability, the TX-2000 delivers higher safety, stability, and analytical performance for contamination control in modern semiconductor fabs. With transparent-wafer compatibility, an integrated FFU for clean wafer transfer, and fully digitalized utilities, it extends the legacy of the TXRF 3760 into a smarter, more robust platform for next-generation Si, SiC, and GaN manufacturing environments.

XHEMIS TX-2000

XHEMIS TX-2000 Overview

The Rigaku XHEMIS TX-2000 represents the evolution of the industry-proven TXRF 3760 platform, engineered to meet the latest SEMI, EMC, and UL safety standards while enhancing throughput, automation, and data intelligence.

Designed for 200 mm wafer fabs, TX-2000 delivers in-line, non-destructive quantification of ultra-trace metallic contaminants on wafer surfaces, empowering fabs to achieve tighter process control and yield optimization across SiC, GaN, and Si device manufacturing.

With integrated safety PLC monitoring, improved ergonomics, digitalized utilities, and optional machine-learning spectral prediction, the TX-2000 ensures robust fab operation with minimal downtime and maximum operator confidence.

XHEMIS TX-2000 Features

Reliability & safety compliance
Conforms to SEMI S2-0821, S8-0218, S14-1016, EN 60204-1:2018 (NFPA 79:2018), UL 508A 3rd
Functional & operational enhancements
Machine-learning spectral prediction (Option): dramatically reduces measurement time by predicting spectral profiles from process recipes
Dual interlock system and added cassette door for physical isolation from moving parts
Transparent substrate compatibility: supports glass, sapphire, and other transparent wafers through advanced Ori-flat search sensor
Safety PLC monitors EMO buttons, power, exterior panels, vacuum switches, and cassette doors
Cassette presence and size detection: prevents mis-operation and enables smooth automation integration
IP22 / IP42 enclosure prevents ingress of particulates and liquids
FFU standard configuration: eliminates need for external FFU in SMIF use; minimizes particle contamination during wafer transfer
SEMI F47 compliant power rack ensures stable performance under voltage fluctuations

XHEMIS TX-2000 Specifications

Technique Total reflection X-ray fluorescence (TXRF)
Measurement items Ultratrace metal contaminants on wafer surfaces
Sample compatibility Si, SiC, GaN, glass, sapphire; up to 200 mm wafers
Compliance SEMI S2-0821 / S8-0218 / S14-1016 / EN 60204-1:2018 / UL 508A 3rd / SEMI F47
Footprint Approx. 1050 mm H × 1025 mm W × 229 mm D (compact fab-fit design)
Power 200 V AC (DC24 V control system)

XHEMIS TX-2000 Application Notes

The following application notes are relevant to this product

XHEMIS TX-2000 Resources

Webinars

Total Reflection X-ray Fluorescence (TXRF) for Semiconductor Manufacturing Watch the Recording

Rigaku Journal articles

adobeMachine learning and application to spectral analysis on TXRF spectrometry Read the Article
adobeEvaluation of contamination of power semiconductor device wafers by total reflection X-ray fluorescence spectrometer Read the Article

XHEMIS TX-2000 Events

Learn more about our products at these events

  • AsCA 2025
    November 30 2025 - December 5 2025
    Taipei, Taiwan
  • SEMICON Japan 2025
    December 16 2025 - December 18 2025
    Tokyo, Japan

Contact Us

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