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XHEMIS TX-2000

Next-generation total reflection X-ray fluorescence system for surface-metal control in semiconductor fabs for wafers up to 200 mm

The XHEMIS TX-2000 is the successor to Rigaku’s proven TXRF 3760, redesigned to meet the latest SEMI, EMC, and UL standards while introducing advanced automation, digital control, and machine-learning capabilities. Building on more than two decades of field-proven reliability, the TX-2000 delivers higher safety, stability, and analytical performance for contamination control in modern semiconductor fabs. With transparent-wafer compatibility, an integrated FFU for clean wafer transfer, and fully digitalized utilities, it extends the legacy of the TXRF 3760 into a smarter, more robust platform for next-generation Si, SiC, and GaN manufacturing environments.

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XHEMIS TX-2000

XHEMIS TX-2000 Overview

The Rigaku XHEMIS TX-2000 represents the evolution of the industry-proven TXRF 3760 platform, engineered to meet the latest SEMI, EMC, and UL safety standards while enhancing throughput, automation, and data intelligence.

Designed for 200 mm wafer fabs, TX-2000 delivers in-line, non-destructive quantification of ultra-trace metallic contaminants on wafer surfaces, empowering fabs to achieve tighter process control and yield optimization across SiC, GaN, and Si device manufacturing.

With integrated safety PLC monitoring, improved ergonomics, digitalized utilities, and optional machine-learning spectral prediction, the TX-2000 ensures robust fab operation with minimal downtime and maximum operator confidence.

XHEMIS TX-2000 Features

Compliance with International Safety Standards
Conforms to S2-0818E​, S8-0218, S14-1016, IEC60204-1:2016 (NFPA 79:2021)​, UL 508A 3rd
Machine-Learning Spectral Prediction (Option)
Reduces measurement time by predicting spectral profiles from process recipes
Dual Interlock System
Dual interlock system and added cassette door for physical isolation from moving parts
Transparent Substrate Compatibility
Supports glass, sapphire, and other transparent wafers through advanced Ori-flat notch search sensor
Safety PLC
Monitors EMO buttons, power, exterior panels, vacuum switches, and cassette doors
Presence and Size Detection
Prevents mis-operation and enables smooth automation integration
IP22/IP42 Compliant
IP22 / IP42 enclosure prevents ingress of particulates and liquids
FFU Standard Configuration
Eliminates need for external FFU in SMIF use; minimizes particle contamination during wafer transfer
SEMI F47
Ensures stable performance during voltage fluctuations

XHEMIS TX-2000 Specifications

Technique Total reflection X-ray fluorescence (TXRF)
Measurement items Ultratrace metal contaminants on wafer surfaces
Sample compatibility Si, SiC, GaN, glass, sapphire; up to 200 mm wafers
Compliance SEMI S2-0818E / S8-0218 / S14-1016 / IEC60204-1:2016 (NFPA 79:2021)​ / UL 508A 3rd / SEMI F47
Footprint Approx. 1050 (W) x 2020 (H) x 1025 (D) mm (compact fab-fit design)
Power 200 V AC (DC24 V control system)

XHEMIS TX-2000 Application Notes

The following application notes are relevant to this product

XHEMIS TX-2000 Resources

Webinars

Total Reflection X-ray Fluorescence (TXRF) for Semiconductor Manufacturing Watch the Recording

Rigaku Journal articles

adobeMachine learning and application to spectral analysis on TXRF spectrometry Read the Article
adobeEvaluation of contamination of power semiconductor device wafers by total reflection X-ray fluorescence spectrometer Read the Article

XHEMIS TX-2000 Events

Learn more about our products at these events

  • SPIE Advanced Lithography + Patterning
    February 22 2026 - February 26 2026
    San Jose, CA, USA 
    Website
  • Florida Semiconductor Summit
    February 23 2026 - February 25 2026
    Orlando, FL, USA
    Website
  • Rigaku Taiwan professional training courses (SCX)
    February 26 2026 - February 26 2026
    Rigaku Taiwan (RTC-TW)
    Website
  • JSAP Spring Meeting 2026
    March 15 2026 - March 16 2026
    Tokyo, Japan
    Website
  • The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum Sponsors
    March 16 2026 - March 19 2026
     Monterey, CA ,USA
    Website
  • SEMICON China 2026
    March 25 2026 - March 27 2026
    SNIEC, Shanghai, China
    Website
  • Rigaku Taiwan professional training courses (XRD)
    March 27 2026 - March 27 2026
    Rigaku Taiwan (RTC-TW)
    Website
  • CS International 2026
    April 20 2026 - April 22 2026
    Brussels, Belgium
    Website
  • SEMICON SEA 2026
    May 5 2026 - May 7 2026
    Kuala Lumpur, Malaysia
    Website
  • ASMC – Advanced Semiconductor Manufacturing Conference
    May 11 2026 - May 14 2026
    Albany, NY, USA
    Website
  • WOCSDICE/EXMATEC 2026
    May 24 2026 - May 28 2026
    Gdańsk, Poland
    Website
  • The 2026 IEEE 76th Electronic Components and Technology Conference
    May 26 2026 - May 29 2026
    Orlando, Fl, USA
    Website
  • CEIA Leti Innovation Days
    June 23 2026 - June 25 2026
    Maison Minatec, Grenoble, France 
    Website
  • The International Workshop on Gallium Oxide and Related Materials (IWGO-6)
    August 2 2026 - August 7 2026
     College Park, MD, USA.
    Website
  • SEMICON Taiwan 2026
    September 2 2026 - September 4 2026
    Taipei, Taiwan
    Website
  • ICSCRM Japan 2026 (Silver Sponsor)
    September 27 2026 - October 2 2026
    Yokohama, Japan
    Website
  • SEMICON West 2026
    October 13 2026 - October 15 2026
    San Francisco, CA, USA 
    Website
  • SEMICON Europa
    November 10 2026 - November 13 2026
    Munich, Germany
    Website
  • SEMICON Japan 2026
    December 9 2026 - December 11 2026
    Tokyo, Japan
    Website

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