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Semiconductor

TFXRD Systems

From Lab to Fab: Scalable thin film XRD solutions for every stage of semiconductor manufacturing.

The TFXRD & XTRAIA TF Series deliver unmatched thin film XRD metrology, from research labs to high-volume fabs. With solutions tailored for R&D, pilot lines, and full-scale production, this portfolio ensures consistent, non-destructive analysis of thin film structure, strain, stress, and thickness. Whether advancing new materials or optimizing manufacturing yield, Rigaku provides a clear pathway from Lab → Near-Fab → Fab.

TFXRD & XTRAIA TF series features

  • Non-destructive thin film metrology – Comprehensive X-ray diffraction (XRD), reflectivity (XRR), and reciprocal space mapping (RSM) in one platform.
  • Full-wafer capability – Supports wafers up to 200 mm and 300 mm depending on model, enabling seamless scale-up from research to high-volume
  • High-resolution detectors – Equipped with Rigaku’s HyPix detector technology for superior data accuracy, speed, and dynamic
  • Material flexibility – Ideal for analyzing wide bandgap semiconductors (SiC, GaN, GaN-on-Si), advanced dielectrics, III–V compounds, and multilayer heterostructures.
  • Process insight – Delivers key parameters such as strain, stress, crystallinity, thickness, density, interface quality, and defect
  • Scalability – Portfolio designed to bridge the gap between R&D labs, pilot lines, and fab production, ensuring consistency across development cycles.
  • Recipe-driven workflows – Simplified, repeatable measurement routines with customizable recipes for faster process qualification.
  • Cleanroom-ready design – All systems engineered for semiconductor environments, with automation scaling from manual handling (Lab) to full fab automation (Fab).
  • Compact footprint – Optimized system design to fit space- constrained labs and fab cleanrooms.
  • Future-ready integration – Compatible with fab automation protocols (SECS/GEM, GEM300) to support digital factory

Products

TFXRD 300-200 - image card
TFXRD Lab

Accelerate discovery with a compact, research-ready XRD platform. Ideal for universities and R&D labs developing new thin film materials and processes.

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TFXRD Near-Fab Series
TFXRD Near-Fab

Bridge the gap between research and production. Semi-automated XRD metrology designed for recipe transfer, process qualification, and pilot-line readiness.

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XTRAIA TF Series - image card
XTRAIA TF-2000

Fab-ready metrology for 200 mm wafers. Delivers high-throughput, automated thin film analysis for specialty fabs and mid-volume production.

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XTRAIA TF Series - image card
XTRAIA TF-3000

Next-generation thin film XRD for 300 mm high-volume fabs. Fully automated and SEMI-compliant, optimized for advanced logic, memory, and power devices.

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Applications

Research & Development
(TFXRD Lab)

  • Discovery and optimization of new thin film materials
  • Characterization of epitaxial growth (GaN, SiC, AlGaN, InGaAs, etc.)
  • Evaluation of lattice strain, stress, and crystallographic orientation
  • Reciprocal space mapping (RSM) for multilayer heterostructures
  • University research and academic training in semiconductor materials

Pre-Production & Pilot Lines
(TFXRD Near-Fab)

  • Recipe transfer from lab to fab environments
  • Process qualification for new device architectures
  • Semi-automated wafer characterization to support pilot runs
  • Evaluation of defect density and layer uniformity before scale-up
  • Early-stage monitoring of high-k/metal gate stacks and advanced dielectrics

200 mm Fab Production
(XTRAIA TF-2000)

  • Routine monitoring of epitaxial growth in power devices (SiC, GaN-on-Si)
  • Structural analysis of thin film stacks for RF and MEMS devices
  • Inline quality control of specialty fabs and mid-volume production lines
  • Early yield enhancement and feedback for production engineers

300 mm High-Volume Fab Production
(XTRAIA TF-3000)

  • Full fab automation for advanced logic and memory production
  • High-throughput structural monitoring of high-k/metal gate stacks
  • Inline process control for 300 mm power, RF, and photonics devices
  • Continuous defect, strain, and thickness analysis to improve yield
  • Integration with fab MES systems (SECS/GEM/GEM300) for automated workflows

 

Which thin film XRD system fits your needs?

System TFXRD Lab TFXRD Near-Fab XTRAIA TF (Fab)
Maximum wafer size 300 mm 300 mm 300 mm
Sample handling Manual Auto + Manual Fully Automated
MiniEnvironment (with FFU) N/A N/A ISO Class 6 equivalent
Wafer ID OCR No Optional Standard
Purpose Lab, R&D, material studies R&D, pilot line, process dev, production QC Full SEMI fab QC, high-volume yield
SEMI (S2/S8) Compliance No No Yes
SECS/GEM and GEM300 No Optional Yes

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