High-resolution X-ray Diffraction (HRXRD)
Advanced semiconductor devices demand precise control of strain, thickness, composition, and crystalline quality. Rigaku’s HRXRD systems deliver high-resolution, high-throughput measurements for blank and patterned wafers, enabling confident process development, device optimization, and production control. From strained silicon and SiGe to GaN, SiC, and complex heterostructures, Rigaku provides the precision required for advanced logic, memory, power, and compound semiconductor manufacturing.
HRXRD for advanced semiconductor manufacturing
As device architectures scale and material systems become more complex, controlling epitaxial layer properties are essential to guarantee performance and yield.
HRXRD enables:
- Precise strain measurement for mobility enhancement
- Epitaxial thickness and composition analysis
- Multilayer heterostructure characterization
- Defect and crystal quality assessment
- Production-ready measurement of blank and patterned wafers
Rigaku’s HRXRD portfolio supports both lab-based development and high-volume fab deployment.
Solutions by application
Blank wafer film process development
TFXRD Series and XTRAIA TF Series
Optimized for epitaxial process development and blank wafer monitoring, the TFXRD Series and XTRAIA TF Series delivers high-resolution XRD and XRR measurements for:
- Epitaxial layer thickness
- Composition and strain
- Multilayer stack analysis
- Early-stage process tuning
Designed for R&D and pilot line environments, the TF Series provides stable, repeatable measurements that accelerate development cycles while maintaining production relevance.
Ideal for:
- Film process engineers
- Epitaxy development teams
- Materials research groups
Patterned wafer device measurement
XTRAIA XD Series
The XTRAIA XD Series extends HRXRD into advanced device manufacturing with µ-spot capability and patterned wafer compatibility. Designed for logic and memory applications, the XD Series enables:
- µ-spot precision measurements (XD3300 option)
- Strain and composition measurement on device pads
- Detailed reciprocal space mapping
- Production-ready automation
By combining HRXRD and XRR capabilities, the XD Series provides in-line compatible characterization of epitaxial films on both blank and patterned wafers.
Ideal for:
- Logic fabs
- Memory manufacturers
- Advanced node device integration
TF vs XD: Selecting the right platform
| Feature | XTRAIA TF Series | XTRAIA XD Series |
| Wafer type | Blanket (Bare) | Blanket (Bare) & Patterned |
| Pattern recognition | No | Yes |
| µ-Spot option | — | Available (XD3300) |
| Primary application | Film process development | Logic & Memory pad measurement |
| Installation environment | R&D / Pilot Fab | R&D / High-Volume Manufacturing |
Core measurement capabilities
Rigaku HRXRD systems provide comprehensive structural characterization for advanced semiconductor materials:
Quantify lattice distortion and strain engineering in strained silicon, SiGe stressors, and compound semiconductors to optimize carrier mobility and device performance.
Determine epitaxial layer thickness, composition, and uniformity in multilayer heterostructures.
Characterize rocking curves, lattice parameters, and crystalline perfection to ensure process stability and material reliability.
Identify threading dislocations, stacking faults, and point defects impacting yield and reliability.
Resolve strain relaxation, composition gradients, and complex heterostructures with high-resolution mapping.
HRXRD for key material systems
Enable mobility enhancement through precise strain quantification and composition control.
Characterize epitaxial quality, stress, and defect density in GaN, SiC, and emerging power semiconductor platforms.
Support process integration for FinFET, GAA, and next-generation device architectures requiring tight strain
control.
Analyze complex stacks for RF, optoelectronic, and compound semiconductor applications.
Designed for production environments
Rigaku HRXRD systems are engineered for deployment beyond research labs:
- Automated wafer handling
- Recipe-driven measurement workflows
- High system stability
- Tool matching capability
- Repeatable, traceable results across R&D and production
These capabilities enable seamless transition from development to high-volume manufacturing.
Why Rigaku
Rigaku combines decades of X-ray expertise with semiconductor process insight:
- Proven installations in advanced fabs
- High-resolution optics optimized for semiconductor materials
- µ-spot patterned wafer capability
- Integrated HRXRD and XRR analysis
- Global service and application support
Rigaku systems are designed not only for measurement precision but for operational reliability in demanding fab environments.
Frequently asked questions
What is HRXRD used for in semiconductor manufacturing?
HRXRD measures strain, lattice parameters, epitaxial thickness, and crystalline quality in semiconductor materials. It is essential for advanced logic, memory, power, and compound semiconductor device fabrication.
Can HRXRD measure patterned wafers?
Yes. The XTRAIA XD Series enables µ-spot measurements on patterned wafers, including logic and memory pad structures.
What is the difference between HRXRD and XRR?
HRXRD measures lattice spacing, strain, and crystalline properties. XRR measures thickness, density, and interface quality. Rigaku systems integrate both capabilities for comprehensive film characterization.
Is HRXRD suitable for high-volume manufacturing?
Yes. Rigaku’s production-configured systems support automation, recipe-driven measurement, and stable repeatability suitable for fab environments.
Accelerate your epitaxial process control
Whether you are developing next-generation strained silicon devices or optimizing wide bandgap materials for power applications, Rigaku HRXRD provides the structural insight required to improve performance and yield.
Contact Us
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