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Semiconductor

Advanced Packaging Metrology

Precision X-ray solutions for microbumps, TSVs, and hybrid bonding

As advanced packaging architectures evolve 2.5D, 3D-IC, chiplets, heterogeneous integration the need for accurate, non-destructive metrology becomes critical.
Microbumps shrink. Hybrid bonds tighten tolerances. TSV structures deepen.
Process windows narrow.

Rigaku delivers X-ray metrology solutions engineered to characterize thickness, composition, and structural integrity across packaging structures from ~100 nm to 100 µm.

From R&D to high-volume manufacturing, our systems provide actionable data for process control, failure analysis, and yield optimization.

Why X-ray metrology for advanced packaging?

Advanced packaging introduces materials and geometries that challenge traditional optical metrology:

  • Opaque metal stacks
  • High aspect ratio vias
  • Buried interfaces
  • Complex multilayer redistribution layers
  • Sub-micron bump pitch

X-ray techniques provide:

 

  • Non-destructive subsurface inspection
  • Element-specific compositional analysis
  • Accurate thickness measurement for metals and liners
  • Micron-scale spatial resolution
  • Sensitivity to voids, defects, and structural variation
  • Rigaku’s portfolio adapts proven semiconductor thin-film and compositional techniques to advanced packaging applications

Key packaging applications

Micro-bump and fine-pitch RDL characterization

Hybrid XRF  and optical microscopy platform designed for micron-scale spatial resolution, enabling:

  • Microbump thickness and volume characterization
  • Under-bump metallization (UBM) thickness control
  • Fine-pitch RDL thickness measurement
  • Element-specific composition analysis (Cu, Sn, Ni, solder alloys)

Learn More about ONYX 3200

TSV (Through-silicon via) inspection

Evaluate:

  • Via fill quality
  • Copper thickness
  • Barrier/liner uniformity
  • Voids and structural defects

Request Information

Rigaku is developing inline X-ray imaging solutions for automated defect detection in micro-bumps and TSVs, supporting high-throughput advanced packaging production.

Blanket RDL
and metal stack
process control

 WaferX 310 

High-precision WDXRF platform optimized for:

  • Blanket copper and metal films
  • Larger-pitch RDL structures
  • Seed and liner composition monitoring
  • Statistical process control in manufacturing

Learn More about WaferX 310

Application notes

HBM Structure

Technical advantages

  • Non-destructive evaluation
  • Suitable for opaque metal systems
  • Micron-scale spatial targeting
  • Adaptable to patterned wafers
  • Configurable for specific element sensitivity
  • Compatible with advanced integration schemes including hybrid bonding and fine-pitch microbumps
Stage Metrology focus
R&D Material stack validation, bump composition studies
Process development Thickness calibration, integration, tuning
Ramp Statistical process control
HVM Inline monitoring and defect detection

Supporting next-generation integration

As AI accelerators, high-bandwidth memory, and heterogeneous integration demand denser packaging, metrology must keep pace.

Rigaku X-ray technologies enable improved yield through defect detection, tight thickness control in copper structures, composition verification for reliability assurance and early detection of process drift.

Explore packaging metrology solutions

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