XHEMIS EX-2000
Features
- Wide range of materials and applications
- Simultaneous evaluation of film thickness, density and roughness
- High-throughput wafer measurements
- Absolute results from XRR (no calibration standards required)
- Full-wafer mapping and high-speed measurements by XRF
- High resolution and precision covering thicknesses from Ångstroms to microns
- Accepts 200 mm, 150 mm, 125 mm and 100 mm wafers
- Available auto-calibration function
XRR AND XRF METROLOGY TOOL FOR BLANKET WAFERS UP TO 200 mm
Thickness, density, roughness and composition of films on blanket wafers
Specifications
Product name | XHEMIS EX-2000 |
Technique | X-ray reflectometry and X-ray fluorescence with XYθ sample stage |
Benefit | Measure ultra-thin single-layer films to multi-layer stacks. Obtain film thickness, density, and roughness by XRR (without standards), obtain thickness / composition by XRF (with standards) |
Technology | XRR and small-spot XRF |
Core attributes | Cu sealed-tube source for XRR; Cr sealed-tube source for XRF, SEMI S2/S8 design |
Core options | Auto loader, XRF system, X-ray tube type, SECS/GEM |
Computer | Internal PC, MS Windows® OS |
Core dimensions | 1250 (W) x 1825 (H) x 2400 (D) mm (with auto loader) |
Mass | 1600 kg (core unit with auto loader) |
Power requirements | 3Ø, 200 VAC 50/60 Hz, 60A |