XHEMIS EX-2000
XRR and EDXRF Metrology Tool for Blanket Wafers
Thickness, density, roughness, and composition of films on blanket wafers
In-line high-volume semiconductor manufacturing
This versatile X-ray metrology tool uses X-ray fluorescence (EDXRF) and X-ray reflectivity (XRR) for high-throughput non-destructive measurement of thickness and density of blanket wafers ranging from ultrathin single-layer films to multilayer stacks for process development and film quality control.
XHEMIS EX-2000 Overview
Designed for high-volume manufacturing
XHEMIS EX-2000 is designed for high-volume manufacturing of up to 200 mm wafers. Outstanding stage alignment before measurement enables quick and accurate measurement of a variety of wafer samples. The highly accurate stage control enables full-surface mapping measurements in a short time.
User-friendly designed tool
When equipped with a transfer robot, XHEMIS EX-2000 can handle wafers automatically. AutoCal (an automatic calibration function) maintains constant tool conditions. User-friendly software makes tool operation and data analysis easy. This tool can be used for a variety of applications from research to production for quality control.
Application examples
Barrier metal, Al/W wire, W process, backside electrode, oxide/nitride films, LED, filters, power devices, MEMS
XHEMIS EX-2000 Features
XHEMIS EX-2000 Specifications
| Technique | X-ray reflectometry (XRR), energy-dispersive X-ray fluorescence (EDXRF) | |
|---|---|---|
| Benefit | Measure ultra-thin single-layer films to multi-layer stacks. Obtain film thickness, density, and roughness by XRR (without standards) Obtain thickness / composition by XRF (with standards) |
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| Technology | XRR and small-spot XRF | |
| Attributes | Blanket wafer metrology Cu sealed-tube source for XRR; Cr sealed-tube source for XRF EDXRF spot size ~ 2 mm diameter |
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| Features | XYθ sample stage Auto loader |
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| Options | Pd sealed-tube source for XRF (optimal for Al) SECS/GEM software |
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| Dimensions | 1250 (W) x 1825 (H) x 2400 (D) mm (with auto loader) | |
| Measurement results | EDXRF: Film thickness and composition XRR: Film thickness, density, and roughness |
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XHEMIS EX-2000 Events
Learn more about our products at these events
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EventDatesLocationEvent website
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SPIE Advanced Lithography + PatterningFebruary 22 2026 - February 26 2026San Jose, CA, USA
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Florida Semiconductor SummitFebruary 23 2026 - February 25 2026Orlando, FL, USA
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Rigaku Taiwan professional training courses (SCX)February 26 2026 - February 26 2026Rigaku Taiwan (RTC-TW)
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JSAP Spring Meeting 2026March 15 2026 - March 16 2026Tokyo, Japan
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The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum SponsorsMarch 16 2026 - March 19 2026Monterey, CA ,USA
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SEMICON China 2026March 25 2026 - March 27 2026SNIEC, Shanghai, China
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Rigaku Taiwan professional training courses (XRD)March 27 2026 - March 27 2026Rigaku Taiwan (RTC-TW)
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CS International 2026April 20 2026 - April 22 2026Brussels, Belgium
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SEMICON SEA 2026May 5 2026 - May 7 2026Kuala Lumpur, Malaysia
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ASMC – Advanced Semiconductor Manufacturing ConferenceMay 11 2026 - May 14 2026Albany, NY, USA
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WOCSDICE/EXMATEC 2026May 24 2026 - May 28 2026Gdańsk, Poland
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The 2026 IEEE 76th Electronic Components and Technology ConferenceMay 26 2026 - May 29 2026Orlando, Fl, USA
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CEIA Leti Innovation DaysJune 23 2026 - June 25 2026Maison Minatec, Grenoble, France
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The International Workshop on Gallium Oxide and Related Materials (IWGO-6)August 2 2026 - August 7 2026College Park, MD, USA.
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SEMICON Taiwan 2026September 2 2026 - September 4 2026Taipei, Taiwan
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ICSCRM Japan 2026 (Silver Sponsor)September 27 2026 - October 2 2026Yokohama, Japan
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SEMICON West 2026October 13 2026 - October 15 2026San Francisco, CA, USA
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SEMICON EuropaNovember 10 2026 - November 13 2026Munich, Germany
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SEMICON Japan 2026December 9 2026 - December 11 2026Tokyo, Japan
XHEMIS EX-2000
Contact Us
Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.