WaferX 310

Simultaneous thickness and composition

The WaferX 310 is ideal for measuring BPSG, PSG and metal films. In addition, thin film BPSG, multilayered circuit film, WSix, electrode films, ferrodielectric thin films, FRAM, next generation DRAM, and SiOF are standard applications for this tool.

Analysis to support sub-micron technology

Highly accurate analyses for the ultralight elements such as B and P in BPSG film has been improved significantly by employing a 4kW high power X-ray tube with a super thin window beryllium window.

Advanced design

The instrument employs a wafer height adjustment mechanism to compensate for differences in wafer thickness and a diffraction avoidance mechanism to eliminate diffraction interference for the transition metals. Integrated FOUP(SMIF) is available, supporting the C-to-C standard. Various user cassettes can also be loaded. FOUP(SMIF) through-the-wall option is available.

Software redesign

• 3D graphics display enables the operator to judge status clearly
• The alarm position is displayed graphically, and accurate maintenance information is provided to the operator.
• “Bubble chart” display enables the operator to easily judge the distribution of intensity on a wafer.
• More flexible parameter setting to avoid X-ray diffraction effects.