WaferX 310

In-Line, Simultaneous WDXRF Spectrometer

Film thickness and composition measurements on blanket wafers

Rigaku's WaferX 310 represents the culmination of more than 40 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Developed as an in-line metrology tool, it is ideally suited to 300 mm high-volume manufacturing environments.

WaferX 310 Overview

Simultaneous thickness and composition

The WaferX 310 is ideal for measuring BPSG, PSG and metal films. In addition, thin film BPSG, multilayered circuit film, WSix, electrode films, ferrodielectric thin films, FRAM, next generation DRAM, and SiOF are standard applications for this tool.

Analysis to support sub-micron technology

Highly accurate analyses for the ultralight elements such as B and P in BPSG film has been improved significantly by employing a 4kW high power X-ray tube with a super thin window beryllium window.

Advanced design

The instrument employs a wafer height adjustment mechanism to compensate for differences in wafer thickness and a diffraction avoidance mechanism to eliminate diffraction interference for the transition metals. Integrated FOUP(SMIF) is available, supporting the C-to-C standard. Various user cassettes can also be loaded. FOUP(SMIF) through-the-wall option is available.

Software redesign

  • 3D graphics display enables the operator to judge status clearly
  • The alarm position is displayed graphically, and accurate maintenance information is provided to the operator.
  • “Bubble chart” display enables the operator to easily judge the distribution of intensity on a wafer.
  • More flexible parameter setting to avoid X-ray diffraction effects.

WaferX 310 Features

Patented "diffraction avoidance" capability for accurate XRF results
High-sensitivity Boron analysis (with AD-Boron channel)
Robotic wafer handling and fully automated operation
Solid-state, oil-free X-ray generator
FOUP, SMIF, and through-the-wall configurations are available to meet the various needs of high-volume manufacturing wafer fabs
GEM300 Software
Auto Calibration

WaferX 310 Specifications

Technique Simultaneous wavelength dispersive X-ray fluorescence
Benefit Thickness and composition of multi-layer stacks for 300 mm and 200 mm wafers
Technology Process WDXRF with 4 kW sealed Rh X-ray tube
Attributes Blanket wafer metrology
20 channels max., fixed type (₄Be ~₉₂U), scanning type (₂₂Ti ~₉₂U)
AutoCal function
Features Designed for measurement throughput
Measurements under vacuum enable light-element sensitivity
Dual FOUP (SMIF) load ports
Options Through-the-wall
High-sensitivity boron detector (AD-Boron)
GEM300 software, E84/OHT Support
Dimensions 1200 (W) x 1950 (H) x 2498 (D) mm
Measurement results Film thickness and composition

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