XHEMIS TX-3000

TXRF Spectrometer

Ultrahigh-speed metal contamination mapping

For up to 300 mm wafers.

XHEMIS TX-3000

XHEMIS TX-3000 Overview

Detection Limit of typical elements (LLD)

Detection limit LLD (E10 atoms/cm²) Al Fe Ni Cu
TXRF 25 0.1 0.1 0.15

Measurement time: 1000 sec


XHEMIS TX-3000 Specifications

Technique Total Reflection X-ray Fluorescence (TXRF)
Benefit Rapid, non-destructive measurement of trace elemental surface contamination (Na – U)
~ 3x improvement in mapping speed 
E9 atoms/cm² detection limit
Technology High-sensitivity metal contamination analysis.
Attributes Three-detector configuration
High-power W-anode X-ray source (9 kW rotating anode) 
Three excitation energies optimized for light, transition, and heavy elements
XYθ sample stage
Dual FOUP load ports
Features Full wafer mapping (SWEEPING-TXRF)
Zero edge exclusion (ZEE-TXRF)
Options Backside analysis (BAC-TXRF)
GEM300 software, E84/OHT support
Dimensions 1280 (W) x 3750 (D) x 2040 (H)
(Excluding monitor and signal tower)
Measurement results Quantitative result, spectrum chart, color contour map, mapping table

XHEMIS TX-3000 Events

Learn more about our products at these events

  • JSAP Autumn EXPO
    September 6 2025 - September 9 2025
    Nagoya, Japan
  • The 86th JSAP Autumn Meeting 2025
    September 6 2025 - September 9 2025
    Tokyo, Japan
  • SEMICON Taiwan
    September 9 2025 - September 11 2025
    Taipei, Taiwan
  • EMRS Fall meeting 2025
    September 14 2025 - September 17 2025
    Warsaw, Poland
  • International Conference on Silicon Carbide and Related Materials (ICSCRM 2025) 
    September 15 2025 - September 18 2025
    Busan, Korea
  • SEMICON Japan
    December 1 2025 - December 2 2025
    Tokyo, Japan

Contact Us

Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.