XHEMIS TX-3000

Total Reflection X-ray Fluorescence System

Ultrahigh-speed metal contamination mapping

Next-generation TXRF system compatible with wafers up to 300 mm in diameter

Total Reflection X-ray fluorescence (TXRF) is widely used in semiconductor manufacturing processes—such as cleaning, lithography, etching, and thin film deposition—for the precise detection of metallic contamination.

The XHEMIS TX-3000 is a state-of-the-art TXRF system equipped with a multi-element detector capable of simultaneously analyzing three locations, in addition to the conventional single-target, triple-beam configuration. This enables high-throughput analysis and allows for highly sensitive and efficient detection of elements ranging from Na to U.

XHEMIS TX-3000

XHEMIS TX-3000 Overview

The XHEMIS TX-3000 is a cutting-edge TXRF system optimized for advanced semiconductor processes, where rapid, non-destructive, and highly sensitive analysis of trace metal contamination is essential.

Developed by Rigaku, the system features a proprietary multi-element detector and a newly designed optical system that irradiates the wafer surface with excitation X-rays over a wide area and with uniform intensity. This enables simultaneous multi-point measurement on silicon wafers, resulting in a threefold increase in throughput. It significantly enhances analytical efficiency in high-volume production lines, contributing to improved reliability in quality control and higher yield rates.

Additionally, the system integrates machine learning-based “Spectrum-forecasting software”, further doubling throughput. The  “Background optimization function” for metal film measurements also expands its applicability to a broader range of materials, including barrier metals, high-k dielectrics, and compound semiconductors.


Detection Limit of typical elements (LLD)

Detection limit LLD (E10 atoms/cm²) Al Fe Ni Cu
TXRF 25 0.1 0.1 0.15

Measurement time: 1000 sec


XHEMIS TX-3000 Features

High-throughput mapping measurement enabled by the multi-element detector during SWEEPING-TXRF analysis
Capable of analyzing a wide range of elements, from Na to U
Rigaku’s proprietary single-target, triple-beam configuration and XYθ stage enable high-precision trace analysis across the entire wafer surface
Comprehensive contamination analysis across all wafer regions is enabled by Zero Edge Exclusion (ZEE-TXRF), which allows measurement up to the wafer edge, and Backside Automatic Contamination TXRF (BAC-TXRF), which provides fully automated backside measurement.
Integration with machine learning-based spectral prediction software further doubles throughput
Designed to support FOUP, SMIF, and various system configurations to meet the diverse needs of high-volume production fabs
Enables elemental analysis of defects by importing measurement results from defect inspection tools

XHEMIS TX-3000 Specifications

Technique Total Reflection X-ray Fluorescence (TXRF)
Benefit Rapid, non-destructive measurement of trace elemental surface contamination (Na – U)
~ 3x improvement in mapping speed 
E9 atoms/cm² detection limit
Technology High-sensitivity metal contamination analysis.
Attributes Three-detector configuration
High-power W-anode X-ray source (9 kW rotating anode) 
Three excitation energies optimized for light, transition, and heavy elements
XYθ sample stage
Dual FOUP load ports
Features Full wafer mapping (SWEEPING-TXRF)
Zero edge exclusion (ZEE-TXRF)
Options Backside analysis (BAC-TXRF)
GEM300 software, E84/OHT support
Dimensions 1280 (W) x 3750 (D) x 2040 (H)
(Excluding monitor and signal tower)
Measurement results Quantitative result, spectrum chart, color contour map, mapping table

XHEMIS TX-3000 Application Notes

The following application notes are relevant to this product

XHEMIS TX-3000 Resources

Webinars

Total Reflection X-ray Fluorescence (TXRF) for Semiconductor Manufacturing Watch the Recording

XHEMIS TX-3000 Events

Learn more about our products at these events

  • JSAP Autumn EXPO
    September 6 2025 - September 9 2025
    Nagoya, Japan
  • The 86th JSAP Autumn Meeting 2025
    September 6 2025 - September 9 2025
    Tokyo, Japan
  • SEMICON Taiwan
    September 9 2025 - September 11 2025
    Taipei, Taiwan
  • EMRS Fall meeting 2025
    September 14 2025 - September 17 2025
    Warsaw, Poland
  • International Conference on Silicon Carbide and Related Materials (ICSCRM 2025) 
    September 15 2025 - September 18 2025
    Busan, Korea
  • SEMICON Japan
    December 1 2025 - December 2 2025
    Tokyo, Japan

Contact Us

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