TXRF-V310
TXRF Spectrometer with Integrated VPD
High-speed metal contamination mapping
Highest sensitivity with VPD
Total reflection X-ray fluorescence (TXRF) analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-V310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system.
The TXRF-V310 includes Rigaku's patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation.
TXRF-V310 Overview
Integrated vapor phase decomposition (VPD) capability enables automatic VPD preparation of one wafer while a TXRF measurement is made on another wafer for the highest sensitivity and high throughput. VPD-TXRF eliminates the operator variability that may occur with ICP-MS, and VPD-TXRF can be completely controlled via factory automation. VPD recovery from selected areas, including the bevel area, is available.
Detection Limit of typical elements (LLD）
| Detection limit LLD (E10 atoms/cm²) | Al | Fe | Ni | Cu |
| TXRF | 25 | 0.10 | 0.10 | 0.15 |
| VPD-TXRF | 0.1 | 0.001 | 0.001 | 0.002 |
Measurement time: 1000 sec
Options
- Sweeping TXRF software enables mapping of the contaminant distribution over the wafer surface to identify "hot spots" that can be automatically re-measured at higher precision.
- ZEE-TXRF capability overcomes the historical 15 mm edge exclusion of original TXRF designs, enabling measurements to be made with zero edge exclusion.
- BAC-TXRF capability enables fully-automated front-side and back-side TXRF measurements of 300 mm wafers with non-contacting wafer flipping.
TXRF-V310 Features
TXRF-V310 Specifications
| Technique | Total reflection X-ray fluorescence (TXRF) with vapor phase decomposition (VPD) | |
|---|---|---|
| Benefit | Measurement of ultra-trace elemental surface contamination; 1E7 atoms/cm² detection limits | |
| Technology | Automatic VPD preparation, three-beam excitation and automatic optics alignment | |
| Attributes | High-power W-anode X-ray source (9 kW rotating anode) Three excitation energies optimized for light, transition, and heavy elements XYθ sample stage Dual FOUP load ports |
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| Features | Full wafer mapping (SWEEPING-TXRF) Zero edge exclusion (ZEE-TXRF) Integrated, automated VPD pre-processing for Si wafers (VPD-TXRF) for highest sensitivity |
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| Options | Backside analysis (BAC-TXRF) GEM300 software, E84/OHT support Vapor phase treatment (VPT-TXRF) for enhanced sensitivity while retaining spatial information VPD for hydrophilic wafer surfaces (e.g. SiC) 200 mm load ports |
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| Dimensions | 1200 (W) x 2050(H) x 2990 (D) mm | |
| Measurement results | Quantitative result, spectrum chart, color contour map, mapping table | |
TXRF-V310 Application Notes
The following application notes are relevant to this product
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RSMD001 - Evaluation Of Wet Cleans In SiC Power MOSFET Fabrication By TXRF
TXRF-V310 Resources
Webinars
| Total Reflection X-ray Fluorescence (TXRF) for Semiconductor Manufacturing | Watch the Recording |
Rigaku Journal articles
 Machine learning and application to spectral analysis on TXRF spectrometry |
Read the Article |
TXRF-V310 Events
Learn more about our products at these events
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EventDatesLocationEvent website
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Rigaku Taiwan professional training courses (XRD)January 23 2026 - January 23 2026Rigaku Taiwan (RTC-TW)
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Rigaku School for Practical CrystallographyJanuary 26 2026 - February 6 2026
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SEMICON Korea 2026February 11 2026 - February 13 2026COEX、韓国
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SPIE Advanced Lithography + PatterningFebruary 22 2026 - February 26 2026San Jose, CA, USA
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Florida Semiconductor SummitFebruary 23 2026 - February 25 2026Orlando, FL, USA
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Rigaku Taiwan professional training courses (SCX)February 26 2026 - February 26 2026Rigaku Taiwan (RTC-TW)
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Applied Physics Society Autumn NagoyaMarch 15 2026 - March 16 2026Tokyo, Japan
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The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum SponsorsMarch 16 2026 - March 19 2026Monterey, CA ,USA
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SEMICON China 2026March 25 2026 - March 27 2026SNIEC, Shanghai, China
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Rigaku Taiwan professional training courses (XRD)March 27 2026 - March 27 2026Rigaku Taiwan (RTC-TW)
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CS International 2026April 20 2026 - April 22 2026Brussels, Belgium
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SEMICON SEA 2026May 5 2026 - May 7 2026Kuala Lumpur, Malaysia
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ASMC – Advanced Semiconductor Manufacturing ConferenceMay 11 2026 - May 14 2026Albany, NY, USA
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The 2026 IEEE 76th Electronic Components and Technology ConferenceMay 26 2026 - May 29 2026Orlando, Fl, USA
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CEIA Leti Innovation DaysJune 23 2026 - June 25 2026Maison Minatec, Grenoble, France
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The International Workshop on Gallium Oxide and Related Materials (IWGO-6)August 2 2026 - August 7 2026College Park, MD, USA.
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SEMICON Taiwan 2026September 2 2026 - September 4 2026Taipei, Taiwan
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ICSCRM Japan 2026 (Silver Sponsor)September 27 2026 - October 2 2026Yokohama, Japan
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SEMICON West 2026October 13 2026 - October 15 2026San Francisco, CA, USA
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SEMICON EuropaNovember 10 2026 - November 13 2026Munich, Germany
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SEMICON Japan 2026December 9 2026 - December 11 2026Tokyo, Japan
TXRF-V310
Contact Us
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