TXRF 3760
Wafer Surface Contamination for up to 200 mm Wafers
Measure elemental contamination at discrete points or with full wafer maps
Total reflection X-ray fluorescence (TXRF) analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system, and a liquid nitrogen-free detector system.
TXRF 3760 Overview
The TXRF 3760 includes Rigaku's patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly Windows software. These contribute to higher throughput, accuracy and precision, and easy routine operation.
Optional Sweeping TXRF software enables mapping the contaminant distribution over the wafer surface to identify "hot spots" that can be automatically re-measured at higher precision.
Optional ZEE-TXRF capability overcomes the historical 15 mm edge exclusion of original TXRF designs, enabling measurements to be made with zero edge exclusion.
High-reliability wafer surface contamination analysis
TXRF is an indispensable tool for materials and device development for semiconductor manufacturing. Remarkable reliability is achieved thanks to newly developed X-ray optics, a new stage mechanism, and a new concept in compact rotating-anode X-ray sources. Also, a new, low-COO TXRF model offers reduced initial and operating costs.
Detection limit of typical elements (LLD)
| Detection limit LLD (E10 atoms/cm²) | Na | Al | Fe | Ni | Cu |
| 25 | 25 | 0.1 | 0.1 | 0.15 |
TXRF 3760 Features
TXRF 3760 Specifications
| System parameters | Specifications | |
|---|---|---|
| Technique | Total reflection X-ray fluorescence (TXRF) | |
| Benefit | Rapid, non-destructive measurement of trace elemental surface contamination (Na – U) | |
| Technology | Three-beam TXRF system with electronically-cooled detector, and automatic optics exchange | |
| Attributes | High-power W-anode X-ray source (9 kW rotating anode) Three excitation energies optimized for light, transition, and heavy elements XYθ sample stage for diffraction avoidance In-vacuum wafer robotic transfer system Accepts up to 200 mm wafers |
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| Features | Full wafer mapping (SWEEPING-TXRF) Zero edge exclusion (ZEE-TXRF) |
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| Options | SECS/GEM software SMIF handling |
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| Dimensions | 1000 (W) x 1760 (H) x 948 (D) mm | |
| Measurement results | Quantitative result, spectrum chart, color contour map, mapping table | |
TXRF 3760 Application Notes
The following application notes are relevant to this product
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RSMD005 - Surface Contamination of SiC, GaN Power Device Wafers
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RSMD001 - Evaluation Of Wet Cleans In SiC Power MOSFET Fabrication By TXRF
TXRF 3760 Resources
Webinars
| Total Reflection X-ray Fluorescence (TXRF) for Semiconductor Manufacturing | Watch the Recording |
Rigaku Journal articles
 Machine learning and application to spectral analysis on TXRF spectrometry |
Read the Article |
| Evaluation of contamination of power semiconductor device wafers by total reflection X-ray fluorescence spectrometer |
Read the Article |
TXRF 3760 Events
Learn more about our products at these events
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EventDatesLocationEvent website
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Rigaku Taiwan professional training courses (XRD)January 23 2026 - January 23 2026Rigaku Taiwan (RTC-TW)
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Rigaku School for Practical CrystallographyJanuary 26 2026 - February 6 2026
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SEMICON Korea 2026February 11 2026 - February 13 2026COEX, South Korea
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SPIE Advanced Lithography + PatterningFebruary 22 2026 - February 26 2026San Jose, CA, USA
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Florida Semiconductor SummitFebruary 23 2026 - February 25 2026Orlando, FL, USA
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Rigaku Taiwan professional training courses (SCX)February 26 2026 - February 26 2026Rigaku Taiwan (RTC-TW)
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Applied Physics Society Autumn NagoyaMarch 15 2026 - March 16 2026Tokyo, Japan
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The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum SponsorsMarch 16 2026 - March 19 2026Monterey, CA ,USA
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SEMICON China 2026March 25 2026 - March 27 2026SNIEC, Shanghai, China
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Rigaku Taiwan professional training courses (XRD)March 27 2026 - March 27 2026Rigaku Taiwan (RTC-TW)
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CS International 2026April 20 2026 - April 22 2026Brussels, Belgium
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SEMICON SEA 2026May 5 2026 - May 7 2026Kuala Lumpur, Malaysia
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ASMC – Advanced Semiconductor Manufacturing ConferenceMay 11 2026 - May 14 2026Albany, NY, USA
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The 2026 IEEE 76th Electronic Components and Technology ConferenceMay 26 2026 - May 29 2026Orlando, Fl, USA
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CEIA Leti Innovation DaysJune 23 2026 - June 25 2026Maison Minatec, Grenoble, France
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The International Workshop on Gallium Oxide and Related Materials (IWGO-6)August 2 2026 - August 7 2026College Park, MD, USA.
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SEMICON Taiwan 2026September 2 2026 - September 4 2026Taipei, Taiwan
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ICSCRM Japan 2026 (Silver Sponsor)September 27 2026 - October 2 2026Yokohama, Japan
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SEMICON West 2026October 13 2026 - October 15 2026San Francisco, CA, USA
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SEMICON EuropaNovember 10 2026 - November 13 2026Munich, Germany
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SEMICON Japan 2026December 9 2026 - December 11 2026Tokyo, Japan
TXRF 3760
Contact Us
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