XTRAIA XD-3300

In-line HRXRD and XRR Metrology Tool

The XTRAIA XD-3300 is a versatile X-ray metrology tool enabling non-destructive analysis of single- and multilayer films on blanket and patterned 300 mm and 200 mm wafers with high throughput in high-volume manufacturing.

Measurements results include film thickness, density, and roughness (by X-ray reflectometry, XRR) and epitaxial film thickness, composition, strain, lattice relaxation, and crystal structure quality (by high-resolution XRD, HRXRD).

XTRAIA XD-3300

XTRAIA XD-3300 Overview

Supports a variety of applications, including in-line XRD/XRR multilayer stacked films, metal thin films, piezoelectric thin films, SiGe, and compound semiconductor film thickness and composition analysis, allowing you to select the optimal equipment configuration depending on the application.

XTRAIA XD-3300 Features

In-line capability for efficient processing
Includes a stage and goniometer for flexible sample positioning
Utilizes a high-resolution X-ray beam with a beam size down to 40 μm
Full automation function for streamlined and efficient operation
Compatibility with both 200 mm and 300 mm wafers
Equipped with a 2-dimensional detector for precise data collection
Supported by advanced analysis software for comprehensive data interpretation

XTRAIA XD-3300 Specifications

Technique High-resolution X-ray diffraction (HRXRD), X-ray reflectometry (XRR)
Benefit For blanket/patterned epitaxial thin films.
Dual-beam (line and micro-spot)
Pattern recognition
X-ray source Source 1: 9 kW Cu rotating anode or 2.2 kW Cu sealed tube
Source 2: COLORS hybrid Cu beam module for patterned wafer measurements
Attributes Blanket and patterned wafer metrology
X-ray optics: Max. 2 monochromators from Ge(400)x2, Ge(220)x2, Ge(220)x4
X-ray detector: 2D (HyPix-3000) 
Small spot size, pattern recognition, high intensity, and chi axis
Highly accurate goniometer
Features High-intensity rotating anode and micro-spot beam
COLORS Hybrid Cu
Options Monochromators
Variety of optical components
GEM300 software, E84/OHT support
Dimensions 1656(W) x 3689(D) x 2289(H) mm
Measurement results HRXRD, XRR, Rocking curve, and RSM

XTRAIA XD-3300 Events

Learn more about our products at these events

  • SOFC-XIX
    July 12 2025 - July 17 2025
    Stockholm, Sweden
  • JSAP Autumn EXPO
    September 6 2025 - September 9 2025
    Nagoya, Japan
  • The 86th JSAP Autumn Meeting 2025
    September 6 2025 - September 9 2025
    Tokyo, Japan
  • SEMICON Taiwan
    September 9 2025 - September 11 2025
    Taipei, Taiwan
  • EMRS Fall meeting 2025
    September 14 2025 - September 17 2025
    Warsaw, Poland
  • International Conference on Silicon Carbide and Related Materials (ICSCRM 2025) 
    September 15 2025 - September 18 2025
    Busan, Korea
  • SEMICON Japan
    December 1 2025 - December 2 2025
    Tokyo, Japan

Contact Us

Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.