XTRAIA XD-3300
In-line HRXRD and XRR Metrology Tool
The XTRAIA XD-3300 is a versatile X-ray metrology tool enabling non-destructive analysis of single- and multilayer films on blanket and patterned 300 mm and 200 mm wafers with high throughput in high-volume manufacturing.
Measurements results include film thickness, density, and roughness (by X-ray reflectometry, XRR) and epitaxial film thickness, composition, strain, lattice relaxation, and crystal structure quality (by high-resolution XRD, HRXRD).
XTRAIA XD-3300 Overview
Supports a variety of applications, including in-line XRD/XRR multilayer stacked films, metal thin films, piezoelectric thin films, SiGe, and compound semiconductor film thickness and composition analysis, allowing you to select the optimal equipment configuration depending on the application.
XTRAIA XD-3300 Features
XTRAIA XD-3300 Specifications
| Technique | High-resolution X-ray diffraction (HRXRD), X-ray reflectometry (XRR) | |
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| Benefit | For blanket/patterned epitaxial thin films. Dual-beam (line and micro-spot) Pattern recognition |
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| X-ray source | Source 1: 9 kW Cu rotating anode or 2.2 kW Cu sealed tube Source 2: COLORS hybrid Cu beam module for patterned wafer measurements |
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| Attributes | Blanket and patterned wafer metrology X-ray optics: Max. 2 monochromators from Ge(400)x2, Ge(220)x2, Ge(220)x4 X-ray detector: 2D (HyPix-3000) Small spot size, pattern recognition, high intensity, and chi axis Highly accurate goniometer |
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| Features | High-intensity rotating anode and micro-spot beam COLORS Hybrid Cu |
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| Options | Monochromators Variety of optical components GEM300 software, E84/OHT support |
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| Dimensions | 1656(W) x 3689(D) x 2289(H) mm | |
| Measurement results | HRXRD, XRR, Rocking curve, and RSM | |
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