XTRAIA XD-3200

X-ray metrology solution for a wide range of applications on blanket wafers

Transistor (SiGe), LED/LD (GaN, GaAs, InP), MEMS / sensors (PZT, AlN), new memory (GST), metal films, and multilayer films

This sophisticated X-ray metrology tool enables high-throughput measurements in high-volume manufacturing on 300 mm (and 200 mm) blanket wafers ranging from ultrathin single-layer films to multilayer stacks. 

The XTRAIA XD-3200’s superior capability results from Rigaku’s world-class developments in key X-ray components, including high-brilliance source technology, multilayer optics, and state-of-the-art 2D detectors with ultrahigh dynamic range and high sensitivity.

The XTRAIA XD-3200 offers:

• X-ray reflectometry (XRR) to characterize thickness, density, and roughness of single- and multilayer films of all types (amorphous, polycrystalline, epitaxial).
• High-resolution XRD (HRXRD) to characterize epitaxial film thickness, composition, strain, and crystalline structure quality by rocking curve (RC) and reciprocal space mapping (RSM) measurements. 
• A ¼-circle chi cradle for twist/tilt-angle measurements and crystal orientation measurements (film texture).