XTRAIA XD-2000-R

Non-destructive X-ray reflectometry metrology tool for multilayer films, EUV masks, and advanced thin-film applications

  • Characterizes multilayer thickness and density
  • Sub-nanometer precision for surface/interface roughness
  • Automated and non-destructive workflow
  • Designed for semiconductor and photomask applications

The XTRAIA XD-2000-R is a precision metrology system that employs X-ray reflectometry (XRR) to measure thin-film properties with exceptional accuracy. It is purpose-built for evaluating multilayer structures in EUV masks and advanced thin films used in semiconductor manufacturing. The tool offers sub-nanometer resolution and supports sample mapping over a large area.

Fully automated and equipped with advanced optical components, the XD-2000-R delivers fast, reliable results for quality assurance and process development environments.

XTRAIA XD-2000-R

XTRAIA XD-2000-R Overview

The XTRAIA XD-2000-R is a high-precision metrology system designed for advanced X-ray reflectometry (XRR) measurements. It offers unmatched accuracy in film thickness, density, and surface/interface roughness analysis. It is specifically engineered for semiconductor and EUV mask applications and is ideal for multilayer film characterization in environments demanding high throughput and detailed analysis.

XTRAIA XD-2000-R Features

Measures film thickness, density, and surface/interface roughness
Compatible with EUV masks (SEMI P37/P38-1102)
Thickness range: 1–400 nm
Cross-sectional X-ray beam size: 0.1 mm × 10 mm or larger
Mapping within a 100 mm radius
Automated recipe-driven operation with laser-based alignment
Optional multi-angle and extended-depth analysis

XTRAIA XD-2000-R Specifications

Technique High-resolution X-ray reflectometry (HRXRR)
Sensitivity Sub-nanometer scale
Sample compatibility EUV masks, SMIF-compatible formats
Measurement items Film thickness, density, interface roughness
Resolution Sub-nanometer vertical resolution
Benefit Accurate multilayer and interface characterization
Automation Fully automated with recipe setup
Technology Goniometer with HyPix detector and multilayer optics
Compliance GEM300, SEMI S2/S8, CE, NFPA, EU directives
Throughput Approx. 15 minutes per measurement point
Core attributes Non-destructive analysis, advanced data interpretation
Core features Precise film metrology, roughness profiling
Options Multi-angle XRR, extended mask handling, advanced software
Measurement results Reflectometry profiles, thickness, roughness, density

XTRAIA XD-2000-R Options

  • Multi-angle reflectometry
  • Custom detectors
  • Environmental control modules
  • Extended mask support

The following accessories are available for this product:

XTRAIA XD-2000-R Events

Learn more about our products at these events

  • JSAP Autumn EXPO
    September 6 2025 - September 9 2025
    Nagoya, Japan
  • The 86th JSAP Autumn Meeting 2025
    September 6 2025 - September 9 2025
    Tokyo, Japan
  • SEMICON Taiwan
    September 9 2025 - September 11 2025
    Taipei, Taiwan
  • EMRS Fall meeting 2025
    September 14 2025 - September 17 2025
    Warsaw, Poland
  • International Conference on Silicon Carbide and Related Materials (ICSCRM 2025) 
    September 15 2025 - September 18 2025
    Busan, Korea
  • SEMICON Japan
    December 1 2025 - December 2 2025
    Tokyo, Japan

Contact Us

Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.