AZX 400

Sequential Wavelength Dispersive XRF Spectrometer for Large Samples

Sequential wavelength dispersive XRF spectrometer offers analytical flexibility

Film thickness and composition measurements on wafers, media disks, coupons, sputtering targets Rigaku's unique AZX 400 sequential wavelength dispersive X-ray fluorescence (WDXRF) spectrometer can measure most elements in the periodic table (from Be to U), making it an ideal thin film evaluation tool for process R&D or in low-volume, high-product-mix environments. The AZX 400's unique ability to accept samples up to 400 mm diameter, 50 mm thick and 30 kg mass also enables composition analysis of sputtering targets, a key measurement capability for processes demanding tight composition control.

AZX 400 Sequential wavelength dispersive XRF spectrometer for large samples AZX 400 1200x627

AZX 400 Overview

XRF with customized sample adapter system

Having the versatility to adapt to your specific sample types and analysis needs, this WDXRF spectrometer is adaptable to various sample sizes and shapes using optional (made to order) adapter inserts. With a variable measurement spot (30 mm to 0.5 mm diameter, with 5-step automatic selection) and mapping capability with multi-point measurements to check for sample uniformity, this uniquely flexible instrument can dramatically streamline your quality control processes.

XRF with available camera and special lighting

Optional real-time camera allows the analysis area to be viewed within software. The operator has complete certainty as to what is being measured.

Traditional WDXRF analytical capabilities

All analytical capabilities of a traditional instrument are retained in this "large sample" variant. Analyze beryllium (Be) through uranium (U) with high-resolution, high-precision WDXRF spectroscopy, from solids to liquids and powders to thin films. Analyze wide composition ranges (ppm to tens of percent) and thicknesses (sub Å to mm). Optionally available is diffraction peak interference rejection, for optimal results for single-crystal substrates. Rigaku AZX 400 wavelength dispersive X-ray fluorescence (WDXRF) spectrometer complies with industry standards SEMI and CE.

AZX 400 applications

  • Sputtering target composition
  • Isolation films: SiO, BPSG, PSG, AsSG, Si₃N₄, SiOF, SiON, etc.
  • High-k and ferro-dielectric films: PZT, BST, SBT, Ta₂O₅, HfSiOx
  • Metal films: Al-Cu-Si, W, TiW, Co, TiN, TaN, Ta-Al, Ir, Pt, Ru, Au, Ni, etc.
  • Electrode films: doped poly-Si (dopant: B, N, O, P, As), amorphous-Si, WSix, Pt, etc.
  • Other doped films (As, P), trapped inert gas (Ne, Ar, Kr, etc.), C (DLC)
  • Ferroelectric thin films, FRAM, MRAM, GMR, TMR; PCM, GST, GeTe
  • Solder bump composition: SnAg, SnAgCuNi
  • MEMS: thickness and composition of ZnO, AlN, PZT
  • SAW device process: thickness and composition of AlN, ZnO, ZnS, SiO (piezo film); Al, AlCu, AlSc, AlTi (electrode film)

AZX 400 accessories

  • Sample camera with special lighting allows the analysis point to be viewed on screen
  • Diffraction interference rejection provides accurate results for single-crystal substrates
  • Fundamental Parameters software for thin film analysis

AZX 400 Features

Large sample analysis
  • Up to 400 mm (diameter)
  • Up to 50 mm (thickness)
  • Up to 30 kg (mass)
Sample adapter system
Adaptable to various sample sizes
Measurement spot
  • 30 mm to 0.5 mm diameter
  • 5-step automatic selection
Mapping capability
Allows multipoint measurements
General purpose
  • Analyze Be - U
  • Elemental range: ppm to %
  • Thickness range: sub Å to mm
Diffraction interference rejection (option)
Accurate results for single-crystal substrates
Small footprint
50% footprint of the previous model
Compliance with industry standards
SEMI, CE marking
Sample view camera (option)

AZX 400 Specifications

Technique Sequential wavelength dispersive X-ray fluorescence
Benefit Flexibility to measure a variety of sample types, including 50 - 300 mm wafers, coupons, and sputtering targets (up to 30 kg)
Technology Analytical flexibility to measure elements from Be to U
Well-suited for process R&D and low-volume, high product mix environments
Attributes 4 kW sealed X-ray tube, sequential type goniometer, primary beam filter; measurement spot sizes 30, 20, 10, 1, and 0.5 mm (diameter)
Features SQX (standardless analysis) software
Measurements under vacuum enable light-element sensitivity
Diffraction peak interference rejection 
Options Wafer loader
Sample view camera 
Dimensions 1376 (W) x 1710 (H) x 890 (D) mm
Measurement results Film thickness and composition

AZX 400 Application Notes

The following application notes are relevant to this product

AZX 400 Resources

Webinars

Adventures in Wavelength Dispersive XRF: Flexible Element Analysis for Thin Films Watch the Recording

Rigaku Journal articles

adobe Evaluation of MEMS device materials by X-ray fluorescence spectrometers for thin films Read the Article

AZX 400 Events

Learn more about our products at these events

  • Rigaku Taiwan professional training courses (XRD)
    January 23 2026 - January 23 2026
    Rigaku Taiwan (RTC-TW)
  • Rigaku School for Practical Crystallography
    January 26 2026 - February 6 2026
  • SEMICON Korea 2026
    February 11 2026 - February 13 2026
    COEX, South Korea
  • SPIE Advanced Lithography + Patterning
    February 22 2026 - February 26 2026
    San Jose, CA, USA 
  • Florida Semiconductor Summit
    February 23 2026 - February 25 2026
    Orlando, FL, USA
  • Rigaku Taiwan professional training courses (SCX)
    February 26 2026 - February 26 2026
    Rigaku Taiwan (RTC-TW)
  • Applied Physics Society Autumn Nagoya
    March 15 2026 - March 16 2026
    Tokyo, Japan
  • The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum Sponsors
    March 16 2026 - March 19 2026
     Monterey, CA ,USA
  • SEMICON China 2026
    March 25 2026 - March 27 2026
    SNIEC, Shanghai, China
  • Rigaku Taiwan professional training courses (XRD)
    March 27 2026 - March 27 2026
    Rigaku Taiwan (RTC-TW)
  • CS International 2026
    April 20 2026 - April 22 2026
    Brussels, Belgium
  • SEMICON SEA 2026
    May 5 2026 - May 7 2026
    Kuala Lumpur, Malaysia
  • ASMC – Advanced Semiconductor Manufacturing Conference
    May 11 2026 - May 14 2026
    Albany, NY, USA
  • The 2026 IEEE 76th Electronic Components and Technology Conference
    May 26 2026 - May 29 2026
    Orlando, Fl, USA
  • CEIA Leti Innovation Days
    June 23 2026 - June 25 2026
    Maison Minatec, Grenoble, France 
  • The International Workshop on Gallium Oxide and Related Materials (IWGO-6)
    August 2 2026 - August 7 2026
     College Park, MD, USA.
  • SEMICON Taiwan 2026
    September 2 2026 - September 4 2026
    Taipei, Taiwan
  • ICSCRM Japan 2026 (Silver Sponsor)
    September 27 2026 - October 2 2026
    Yokohama, Japan
  • SEMICON West 2026
    October 13 2026 - October 15 2026
    San Francisco, CA, USA 
  • SEMICON Europa
    November 10 2026 - November 13 2026
    Munich, Germany
  • SEMICON Japan 2026
    December 9 2026 - December 11 2026
    Tokyo, Japan

Contact Us

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