AZX 400
Sequential Wavelength Dispersive XRF Spectrometer for Large Samples
Sequential wavelength dispersive XRF spectrometer offers analytical flexibility
Film thickness and composition measurements on wafers, media disks, coupons, sputtering targets Rigaku's unique AZX 400 sequential wavelength dispersive X-ray fluorescence (WDXRF) spectrometer can measure most elements in the periodic table (from Be to U), making it an ideal thin film evaluation tool for process R&D or in low-volume, high-product-mix environments. The AZX 400's unique ability to accept samples up to 400 mm diameter, 50 mm thick and 30 kg mass also enables composition analysis of sputtering targets, a key measurement capability for processes demanding tight composition control.


AZX 400 Overview
XRF with customized sample adapter system
Having the versatility to adapt to your specific sample types and analysis needs, this WDXRF spectrometer is adaptable to various sample sizes and shapes using optional (made to order) adapter inserts. With a variable measurement spot (30 mm to 0.5 mm diameter, with 5-step automatic selection) and mapping capability with multi-point measurements to check for sample uniformity, this uniquely flexible instrument can dramatically streamline your quality control processes.
XRF with available camera and special lighting
Optional real-time camera allows the analysis area to be viewed within software. The operator has complete certainty as to what is being measured.
Traditional WDXRF analytical capabilities
All analytical capabilities of a traditional instrument are retained in this "large sample" variant. Analyze beryllium (Be) through uranium (U) with high-resolution, high-precision WDXRF spectroscopy, from solids to liquids and powders to thin films. Analyze wide composition ranges (ppm to tens of percent) and thicknesses (sub Å to mm). Optionally available is diffraction peak interference rejection, for optimal results for single-crystal substrates. Rigaku AZX 400 wavelength dispersive X-ray fluorescence (WDXRF) spectrometer complies with industry standards SEMI and CE.
AZX 400 applications
- Sputtering target composition
- Isolation films: SiO₂, BPSG, PSG, AsSG, Si₃N₄, SiOF, SiON, etc.
- High-k and ferro-dielectric films: PZT, BST, SBT, Ta₂O₅, HfSiOx
- Metal films: Al-Cu-Si, W, TiW, Co, TiN, TaN, Ta-Al, Ir, Pt, Ru, Au, Ni, etc.
- Electrode films: doped poly-Si (dopant: B, N, O, P, As), amorphous-Si, WSix, Pt, etc.
- Other doped films (As, P), trapped inert gas (Ne, Ar, Kr, etc.), C (DLC)
- Ferroelectric thin films, FRAM, MRAM, GMR, TMR; PCM, GST, GeTe
- Solder bump composition: SnAg, SnAgCuNi
- MEMS: thickness and composition of ZnO, AlN, PZT
- SAW device process: thickness and composition of AlN, ZnO, ZnS, SiO₂ (piezo film); Al, AlCu, AlSc, AlTi (electrode film)
AZX 400 accessories
- Sample camera with special lighting allows the analysis point to be viewed on screen
- Diffraction interference rejection provides accurate results for single-crystal substrates
- Fundamental Parameters software for thin film analysis
AZX 400 Features
- Up to 400 mm (diameter)
- Up to 50 mm (thickness)
- Up to 30 kg (mass)
- 30 mm to 0.5 mm diameter
- 5-step automatic selection
- Analyze Be - U
- Elemental range: ppm to %
- Thickness range: sub Å to mm
AZX 400 Specifications
Technique | Sequential wavelength dispersive X-ray fluorescence | |
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Benefit | Flexibility to measure a variety of sample types, including 50 - 300 mm wafers, coupons, and sputtering targets (up to 30 kg) | |
Technology | Analytical flexibility to measure elements from Be to U Well-suited for process R&D and low-volume, high product mix environments |
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Attributes | 4 kW sealed X-ray tube, sequential type goniometer, primary beam filter; measurement spot sizes 30, 20, 10, 1, and 0.5 mm (diameter) | |
Features | SQX (standardless analysis) software Measurements under vacuum enable light-element sensitivity Diffraction peak interference rejection |
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Options | Wafer loader Sample view camera |
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Dimensions | 1376 (W) x 1710 (H) x 890 (D) mm | |
Measurement results | Film thickness and composition |
AZX 400 Application Notes
The following application notes are relevant to this product
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RSMD006 - Thickness and Composition of Piezoelectric PZT Films
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RSMD003 - WDXRF Composition Mapping of a PZT Sputtering Target
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RSMD002 - Thickness Characterization of a Power Device Backside Electrode
AZX 400 Resources
Webinars
Adventures in Wavelength Dispersive XRF: Flexible Element Analysis for Thin Films | Watch the Recording |
Rigaku Journal articles
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Read the Article |
AZX 400 Events
Learn more about our products at these events
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EventDatesLocationEvent website
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SEMICON SEAMay 19 2025 - May 21 2025Singapore
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EMRS Spring Meeting 2025May 25 2025 - May 29 2025Strasbourg, France
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Leti Innovation Days 2025June 24 2025 - June 26 2025Grenoble, France
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SOFC-XIXJuly 12 2025 - July 17 2025Stockholm, Sweden
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JSAP Autumn EXPOSeptember 6 2025 - September 9 2025Nagoya, Japan
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The 86th JSAP Autumn Meeting 2025September 6 2025 - September 9 2025Tokyo, Japan
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SEMICON TaiwanSeptember 9 2025 - September 11 2025Taipei, Taiwan
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EMRS Fall meeting 2025September 14 2025 - September 17 2025Warsaw, Poland
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International Conference on Silicon Carbide and Related Materials (ICSCRM 2025)September 15 2025 - September 18 2025Busan, Korea
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SEMICON JapanDecember 1 2025 - December 2 2025Tokyo, Japan

Contact Us
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