EDXRF, XRD, and XRR Metrology

EDXRF, XRR, XRD and Optical Techniques.Typically for characterization of multilayered samples for BEOL and advanced packaging applications.

The ONYX Series is a cutting-edge wafer metrology tool that combines advanced X-ray and optical techniques. It offers a unique approach to metrology in several areas from FEOL through WLP, leading to in-line solutions for these processes. This sophisticated hybrid metrology tool enables high-throughput, in-line measurements on both blanket and product wafers, ranging from ultra-thin single-layer films to multi-layer stacks. It combines micro-spot ED-XRF and 2D microscope with a 3D scanner, allowing for in-line, non-destructive inspection and metrology.

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