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Semiconductor

Accelerating Semiconductor Innovation Through Advanced X-ray Metrology

Meet Rigaku at booth N0592 at SEMICON Taiwan 2026: September 2-4, 2026 

 As AI drives the demand for advanced logic, HBM, and advanced packaging, semiconductor manufacturing is reaching new levels of complexity. Accurate, production-ready metrology is more critical than ever. 

Join Rigaku at SEMICON Taiwan to discover how our X-ray metrology and inspection solutions help semiconductor manufacturers, foundries, OSATs, and materials suppliers accelerate innovation, improve yield, and gain deeper process insight across the entire semiconductor value chain.

View our Digital Metrology Solutions Guide.
Explore the latest metrology technologies for advanced logic, HBM, and advanced packaging

Meet Rigaku semiconductor experts

Visit our distributor Scientech Corporation at booth M0338 4th floor, TaiNEX 1

Receive a complimentary copy of the Rigaku 75th Anniversary Journal

R75th_symbol

Celebrate 75 years of innovation

Receive a complimentary Rigaku 75th Anniversary Journal

Reserve Yours Here

Schedule a meeting with Rigaku before the event and receive your complimentary anniversary journal during your booth visit (N0592, 4th floor, TaiNEX 1).

Available while supplies last.

Powering the future of semiconductor manufacturing

For 75 years, Rigaku has helped scientists, engineers, and manufacturers turn complexity into clarity.

Today, semiconductor leaders face new challenges:

  • HBM process complexity
  • Hybrid bonding integration
  • Advanced packaging inspection
  • Thin-film process control
  • Next-generation memory architectures
  • High-volume manufacturing scalability
 

Rigaku delivers advanced metrology solutions designed to provide actionable insights from R&D through high-volume production.

Rigaku across the semiconductor value chain

Comprehensive metrology solutions from crystal growth to advanced packaging

Visit our booth (N0592) to explore Rigaku's Semiconductor Process Map and see how our technologies support critical measurement applications across:
 
Semicon Taiwan infographic

Whether optimizing next-generation logic devices, advanced memory products, or complex packaging architectures, Rigaku provides the measurement confidence needed for process success.

Featured technologies at SEMICON Taiwan

XTRAIA XD-3300

Direct analysis of superlattice structures on ultra-Small wafer pads

As semiconductor structures shrink and become increasingly complex, manufacturers require precise metrology on ever-smaller targets.

Ideal for advanced logic, memory, and emerging semiconductor technologies.

  • High-resolution XRD/XRR measurements
  • Superlattice characterization
  • Measurements on ultra-small pads
  • Faster process feedback
  • Enhanced development productivity
Learn More

XTRAIA MF-3400

Direct visualization of nanoscale structures

The XTRAIA MF-3400 provides non-destructive direct visualization and measurement of nanoscale semiconductor structures

  • Simultaneous thickness and composition analysis
  • Advanced multilayer characterization
  • Improved process monitoring
  • Reduced measurement times
  • Increased manufacturing throughput
Learn More

Advanced packaging solutions

ONYX Series

Non-destructive characterization of multilayer structures for:

  • Advanced packaging
  • HBM applications
  • Hybrid bonding architectures
  • BEOL process control

XHENA AX-3000

Advanced X-ray inspection technology supporting:

  • Defect detection
  • Failure analysis
  • Process optimization
  • Packaging quality control
Discover how Rigaku solutions help improve package reliability, yield, and manufacturing efficiency

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Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.

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