Thin film
Thin-Film composition and thickness analysis
WDXRF Series
WDXRF provides highly accurate, non-destructive measurement of semiconductor materials and multilayer thin-film structures.
Applications
- • BEOL metal stacks
- • Copper metallization
- • Barrier layer analysis
- • Dielectric film characterization
- • Multilayer semiconductor structures
- • Advanced packaging materials
Measurements
- • High-precision elemental analysis
- • Light element measurement capability
- • Non-destructive testing
- • Rapid process feedback
Contamination control
Ultra-trace surface contamination analysis
TXRF Series
Surface cleanliness has a direct impact on yield, device reliability, and manufacturing performance.
Applications
- • Surface contamination monitoring
- • Metallic impurity detection
- • Wafer cleanliness verification
- • Process qualification
- • Contamination mapping
- • Yield enhancement programs
Measurements
- • Ultra-low detection limits
- • Full-wafer contamination mapping
- • Process qualification
- • Contamination mapping
- • Improved device reliability
Process development
Thickness, composition, density, and structure, all from a single platform
XTRAIA MF Series
Combining XRF, XRR, and XRD technologies, the XTRAIA MF Series provides comprehensive semiconductor materials characterization from a single platform.
Applications
- • Thin-film thickness measurement
- • Multilayer semiconductor stacks
- • BEOL process development
- • Semiconductor materials research
- • Advanced packaging materials
- • Process optimization and troubleshooting
Measurements
- • Thickness analysis
- • Density measurement
- • Composition analysis
- • Surface and interface characterization
- • Non-destructive measurements
Contact Us
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