Rigaku at SEMICON Europa 2026
Metrology across the semiconductor value chain
November 10-13, 2026 | Munich, Germany
Hall B0 | Booth B0717
From crystal growth to advanced packaging, Rigaku delivers comprehensive X-ray metrology and materials characterization solutions that help semiconductor manufacturers improve process control, accelerate development, and enhance yield. Explore how our technologies support every stage of the semiconductor value chain.
| Reserve Your Meeting |
Nov 10-13 |
Hall 80 | Booth B0717 |
01 ·Start of the chain
Materials & wafers
Get crystal quality, cleanliness and epitaxial layers right before the first process step.
Ensure crystal integrity from the start.
Crystal orientation · Lattice perfection · Structural defects · Ingot qualification
Detect defects before they impact yield.
Metallic contamination · Trace elements · Surface cleanliness · Incoming inspection
Accelerate SiC and advanced materials development.
Epi thickness · Composition · Defect density · Stress & strain
Qualify substrates and monitor epitaxial growth for power devices.
Crystal quality · Lattice parameters · Crystalline orientation · Defect density
02 ·Front-end process
Lithography, etch, & thin films
Protect pattern fidelity and measure complex structures at advanced nodes.
Characterize EUV mask materials and multilayer structures.
Multilayer thickness · Film density · Layer uniformity · Contamination
Dimensional accuracy for DRAM and 3D NAND.
Critical dimensions · Line width · Sidewall profile · Strain distribution
Monitor shape evolution in high aspect-ratio structures.
Structure profile · Sidewall angle · Feature height · Residual stress
Understand materials at every layer.
Film thickness · Composition · Crystallinity · Density
03 · Back-end & beyond
Packaging, electronics, & labs
From chiplets to failure analysis, see inside assemblies without destroying them.
Wafer-level, panel-level, 2.5D/3D and chiplet integration.
Bump composition · UBM thickness · Metal stack · Package materials
From innovation to production.
Void detection · Solder integrity · Crack detection · Component position
Non-destructive 3D imaging of hidden defects.
Delamination · Voids · Cracks · Structural anomalies
Root-cause investigations and new technology development
Lattice strain · Residual stress · Film thickness · Material composition.
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Let's discuss your application Meet our semiconductor metrology specialists |
Personalized guidance on measurement strategy, process optimization, yield improvement, materials characterization, advanced packaging and electronics inspection. Hall B0 • Booth B0717 • Nov 10-13 |
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