UBM/RDL: Thickness and Composition Monitoring

Hybrid metrology application

ubm rdl bump image (square)
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Analysis of multi-stack structures and thick mono-layers

Multi-stack structures and thick mono-layers are efficiently analyzed by XRF for layer thickness and composition whereas optical metrology technologies are not capable of simultaneously distinguishing between separate layers, which necessitates measuring each layer before application of the next layer.

Other X-ray techniques such as XRR are not capable of measuring non-planar structures.

  • Multi stack analysis in one shot
  • CuNiPd / CuNiAu / CuNiZn
  • High-throughput performance
  • Multi-element detection is discrete
  • Robust fundamental parameter algorithm for thickness extraction

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