XTRAIA CD-3200T
Advanced transmission X-ray critical dimension metrology tool
- Transmission SAXS for high-aspect-ratio nanostructures
- Full-wafer mapping with subnanometer resolution
- Nondestructive analysis of shape, depth, and tilt
- Supports DRAM, 3D-NAND, FinFET, and EUV resist profiling
The XTRAIA CD-3200T delivers advanced critical dimension metrology using transmission small angle X-ray scattering (TSAXS). Designed for nondestructive analysis of high-aspect-ratio features, the system provides accurate measurements of nanostructure depth, sidewall angles, and 3D profiles without sample modification.
Its full-wafer mapping capabilities and compatibility with both organic and inorganic materials make it an ideal tool for evaluating advanced memory structures and pattern fidelity. The system’s immediate measurement capability and high-throughput performance enable streamlined CD control across production and development environments.
XTRAIA CD-3200T Overview
Engineered for manufacturers of memory and logic devices, the XTRAIA CD-3200T applies TSAXS to deliver high-precision, non-destructive analysis of nanostructures. It simplifies quality monitoring by supporting a wide range of materials and patterns without requiring measurement libraries or pre-treatment.
The XTRAIA CD-3200T is an advanced metrology tool designed for precise characterization of nanostructures in semiconductor manufacturing. It uses transmission small angle X-ray scattering (TSAXS) technology for accurate critical dimension (CD) measurements, including sidewall angles.
Optimized for high-throughput applications, it enables full-wafer mapping with sub-nanometer resolution and can evaluate both organic and inorganic materials, providing reliable data for quality control. Its high sensitivity and innovative design make the XTRAIA CD-3200T essential for precision and efficiency in semiconductor production.
XTRAIA CD-3200T Features
XTRAIA CD-3200T Specifications
| Technique | Transmission small angle X-ray scattering (TSAXS) | |
|---|---|---|
| Benefit | CD profiling of HAR structures with subnanometer resolution | |
| X-ray source | Rotating anode (Mo Ka, 17.4 keV) | |
| X-ray optics | Multilayer mirror optics | |
| X-ray detector | HyPix 6000HE (2D) | |
| Sample compatibility | Patterned wafers, organic and inorganic materials | |
| Attributes | High-aspect ratio metrology; deep-hole, 3D structure profiling | |
| Features | Pattern recognition, full-wafer mapping | |
| Options | GEM300 software, E84/OHT compatibility | |
| Measurement results | CD profile, depth, shape, in-plane tilt, full-wafer CD mapping | |
XTRAIA CD-3200T Options
- GEM300 compliance package
- E84/OHT automation support
The following accessories are available for this product:
XTRAIA CD-3200T Resources
Rigaku Journal articles
 Small-angle X-ray scattering shape metrology for 3D semiconductor devices |
Read the Article |
XTRAIA CD-3200T Events
Learn more about our products at these events
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EventDatesLocationEvent website
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Rigaku School for Practical CrystallographyJanuary 26 2026 - February 6 2026
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SEMICON Korea 2026February 11 2026 - February 13 2026COEX, South Korea
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SPIE Advanced Lithography + PatterningFebruary 22 2026 - February 26 2026San Jose, CA, USA
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Florida Semiconductor SummitFebruary 23 2026 - February 25 2026Orlando, FL, USA
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Rigaku Taiwan professional training courses (SCX)February 26 2026 - February 26 2026Rigaku Taiwan (RTC-TW)
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Applied Physics Society Autumn NagoyaMarch 15 2026 - March 16 2026Tokyo, Japan
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The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum SponsorsMarch 16 2026 - March 19 2026Monterey, CA ,USA
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SEMICON China 2026March 25 2026 - March 27 2026SNIEC, Shanghai, China
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Rigaku Taiwan professional training courses (XRD)March 27 2026 - March 27 2026Rigaku Taiwan (RTC-TW)
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CS International 2026April 20 2026 - April 22 2026Brussels, Belgium
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SEMICON SEA 2026May 5 2026 - May 7 2026Kuala Lumpur, Malaysia
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ASMC – Advanced Semiconductor Manufacturing ConferenceMay 11 2026 - May 14 2026Albany, NY, USA
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WOCSDICE/EXMATEC 2026May 24 2026 - May 28 2026Gdańsk, Poland
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The 2026 IEEE 76th Electronic Components and Technology ConferenceMay 26 2026 - May 29 2026Orlando, Fl, USA
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CEIA Leti Innovation DaysJune 23 2026 - June 25 2026Maison Minatec, Grenoble, France
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The International Workshop on Gallium Oxide and Related Materials (IWGO-6)August 2 2026 - August 7 2026College Park, MD, USA.
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SEMICON Taiwan 2026September 2 2026 - September 4 2026Taipei, Taiwan
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ICSCRM Japan 2026 (Silver Sponsor)September 27 2026 - October 2 2026Yokohama, Japan
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SEMICON West 2026October 13 2026 - October 15 2026San Francisco, CA, USA
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SEMICON EuropaNovember 10 2026 - November 13 2026Munich, Germany
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SEMICON Japan 2026December 9 2026 - December 11 2026Tokyo, Japan
XTRAIA CD-3200T
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