XTRAIA CD-3010G

Grazing-incidence X-ray scattering critical dimension metrology tool for semiconductor applications

  • GI-SAXS-based non-destructive CD and shape profiling
  • Sub-nanometer precision for shallow and repeating structures
  • Full-wafer mapping and pattern recognition
  • Ideal for FinFETs, EUV resists, and shallow memory features

The XTRAIA CD-3010G is designed for critical dimension analysis using grazing-incidence small angle X-ray scattering (GI-SAXS). This advanced metrology tool enables structural profiling of nanoscale patterns including line-and-space, dot, or shallow hole features without damaging the sample.

 Its compatibility with a variety of materials—including EUV resist layers—combined with full-wafer mapping and robust pattern recognition makes it suitable for both R&D and high-volume production environments.

XTRAIA CD-3010G 600 600

XTRAIA CD-3010G Overview

The XTRAIA CD-3010G is a cutting-edge metrology tool designed for nondestructive evaluation of critical dimensions (CD) and structural characteristics in semiconductor manufacturing. Leveraging grazing incidence small angle X-ray scattering (GI-SAXS) technology, this system delivers precise measurements of nanoscale structures, including depth, shape, sidewall angle, and more.

Tailored for advanced manufacturing, the XTRAIA CD-3010G ensures superior accuracy and reliability, making it a vital solution for both R&D and high-volume production.

XTRAIA CD-3010G Features

Utilizes GI-SAXS for shallow pattern CD analysis
Supports full-wafer mapping with pattern recognition
Enables profiling of shape, depth, and sidewall angle
Organic material compatibility without damage
Measurement of FinFETs, shallow trenches, EUV patterns
Minimal sample preparation required

XTRAIA CD-3010G Specifications

Technique Grazing-incidence small angle X-ray scattering (GI-SAXS), XRR
Benefits Precision CD profiling of shallow structures with repeating patterns
X-ray source Sealed tube, Cu Ka (8.04 KeV)
X-ray optics Multilayer mirror optics
X-ray detector 2D detector  
Sample compatibility Patterned wafers (resist, FinFETs, memory structures)
Attributes Line & space, dot/hole, shallow structure profiling
Features Pattern recognition, full-wafer CD mapping
Options GEM300 software, E84/OHT automation
Measurement results CD width, sidewall angle, shape, height, tilt distribution

XTRAIA CD-3010G Options

  • Automation and factory integration kits
  • Custom software modules for CD analysis

The following accessories are available for this product:

XTRAIA CD-3010G Events

Learn more about our products at these events

  • Thermal Analysis Technology Seminar & Workshop
    October 15 2025 - October 15 2025
    Taipei, Taiwan
  • Thermal Analysis Technology Seminar & Workshop
    October 16 2025 - October 16 2025
    Taoyuan City, Taiwan
  • SEMICON Japan 2025
    December 16 2025 - December 18 2025
    Tokyo, Japan

Contact Us

Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.