XRTmicron

Topography engineered for performance

Unmatched scan speed ten times higher compared to that of conventional systems is achieved by combining a high-brilliance dual-wavelengths X-ray source, the MicroMax-007 DW, and X-ray mirrors optimized for the topography application. Both Cu and Mo X-ray anodes and their mirrors are simultaneously mounted on the system and switched on-demand to perform reflection and transmission measurements without any system reconfiguration. A digital image of dislocations is captured by a either a high resolution (5.4 μm pixels) or ultra-high resolution (2.4 μm pixels) CCD camera. Both cameras can be simultaneously mounted on the system and switched on-demand depending on the required resolution.

Fully automated X-ray topography

Engineered for usability, the entire data image collection process—including anode switch, detector switch, optics switch and alignment, sample alignment and image collection—is fully automated. Furthermore, the system can be combined with a wafer loader and image recognition based dislocation counting software. Customized recipes can be built to automate the entire process from loading a wafer to reporting dislocation densities.