XTRAIA MF-3000
XRR, EDXRF, and XRD Metrology Tool
For composition and thickness (EDXRF), thickness, density, and roughness (XRR) for unpatterned and patterned films for up to 300 mm wafers
For thin-film applications, precise measurements of small areas are obtained, and high brightness is achieved in localized spots.
The Rigaku XTRAIA MF-3000 (formerly MFM310) performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.
XTRAIA MF-3000 Overview
Designed for high-volume manufacturing
The XTRAIA MF-3000 is designed with high-volume 200 mm and 300 mm manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and S2/S8 Compliance for semiconductor production clean room operation, compliance with GEM300/HSMS and factory automation standards, high-reliability machine performance and low power consumption and cost of ownership.
COLORS enabling technology
COLORS X-ray optics were developed by Rigaku for the XTRAIA MF-3000 to enable measurements from small areas. COLORS beam modules couple a variety of XRF excitation sources with optics and are optimized to provide high brightness in small spots for a variety of thin film applications. With its own X-ray optics business, Rigaku is well-positioned develop and manufacture X-ray sources for current and future market needs.
XTRAIA MF-3000 Features
XTRAIA MF-3000 Videos
XTRAIA MF-3000 Specifications
| Technique | X-ray reflectometry (XRR), energy dispersive X-ray rluorescence (EDXRF), X-ray diffraction (XRD) | |
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| Benefit | High-throughput measurement of blanket and product wafers from ultra-thin films to micron-order films, applicable to a wide range of thickness and film types | |
| Technology | Process micro-spot XRR, EDXRF, and XRD | |
| Attributes | Blanket and patterned wafer metrology Choice of monochromatic, micro-spot X-ray beam modules (COLORS) |
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| Features | Ultra-fast detector with up to 10⁸ dynamic range Dual FOUP load ports |
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| Options | GEM300 software, E84/OHT support | |
| Dimensions | 1400 (W) x 2050 (H) x 3410 (D) mm | |
| Measurement results | EDXRF: Film thickness and composition XRR: Film thickness, density, and roughness |
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