ONYX 3200

In-line Dual-head Micro-spot XRF

Non-destructive wafer inspection and metrology

Dual X-ray source (polycapillary / monochromatic)

For up to 300 mm wafers.

ONYX 3200 Overview

The ONYX 3200 is the most advanced hybrid metrology solution in the market; with its dual head, the second-generation tool combines advanced μXRF and optical techniques to provide high accuracy in defect detection and the highest throughput for in-line semiconductor manufacturing.

The ONYX series systems are designed to provide a holistic metrology approach in all steps of the manufacturing process from FEOL through WLP, including optimal configuration for advanced packaging and single bump applications to monitor Ag/Sn ratio—proven results in measuring and identifying single solder μ-bumps less than 5μm diameter.

Optimized source capability

Single μ-bump measurements for process monitoring
High yield and improved throughput
Accurate analysis for metal thickness and composition
Maximum sensitivity for layer thickness and composition

2D Microscope	2D Microscope Magnification	3D Scanner

ONYX 3200 Features

Dual-head μXRF configuration offers analytical flexibility for optimal application performance

Monochromatic and polychromatic μXRF optics

Low-power X-ray; non-destructive

Focused vertical excitation configuration

Array of four silicon drift detectors (SDD) with a large active area and improved resolution.

Composition analysis and thickness and measurements

Fully automated calibration processes ensure long-term stability, consistency, and tube aging correction

Advanced motion platform for sub-micron accuracy

Ideal for in-line HVM metrology

ONYX 3200 Specifications

Metrology type	Dual-head micro-spot EDXRF and optical inspection (2D-3D)
Wafer size	Up to 300 mm
Wafer type	Blanket and patterned wafers
Navigation	Precise stage complemented with an image recognition algorithm Sub-micron fast navigation to single feature center
Micro XRF beam orientation	Vertical incidence micro-spot (µXRF)
Optics	"Polychromatic” (X-ray optics) and COLORS “Monochromatic” (X-ray optics)
Micro XRF beam spot size	10-50 µm spot sizes adjustable
Detector type	Silicon drift detector (SDD): 3 configurations 1. Regular > Al 2. Light-element: C, N, O, F, S 3. Heavy-element: > Ge (optimized for Ag, Sn)
DPP \| Digital Pulse Processor	High efficiency of more than 1 million photons/sec.
X/Y stage accuracy	0.1 µm