ONYX 3200

In-line Dual-head Micro-spot XRF

Non-destructive wafer inspection and metrology

Dual X-ray source (polycapillary / monochromatic) 

For up to 300 mm wafers.

ONYX 3200

ONYX 3200 Overview

The ONYX 3200 is the most advanced hybrid metrology solution in the market; with its dual head, the second-generation tool combines advanced μXRF and optical techniques to provide high accuracy in defect detection and the highest throughput for in-line semiconductor manufacturing.

The ONYX series systems are designed to provide a holistic metrology approach in all steps of the manufacturing process from FEOL through WLP, including optimal configuration for advanced packaging and single bump applications to monitor Ag/Sn ratio—proven results in measuring and identifying single solder μ-bumps less than 5μm diameter.

Optimized source capability

  • Single μ-bump measurements for process monitoring
  • High yield and improved throughput
  • Accurate analysis for metal thickness and composition
  • Maximum sensitivity for layer thickness and composition
2D Microscope
2D Microscope Magnification
 3D Scanner

3d scanner features

2d microscope magnification

2d microscope features-1

ONYX 3200 Features

Dual-head μXRF configuration offers analytical flexibility for optimal application performance
Monochromatic and polychromatic μXRF optics
Low-power X-ray; non-destructive
Focused vertical excitation configuration
Array of four silicon drift detectors (SDD) with a large active area and improved resolution.
Composition analysis and thickness and measurements
Fully automated calibration processes ensure long-term stability, consistency, and tube aging correction
Advanced motion platform for sub-micron accuracy
Ideal for in-line HVM metrology

ONYX 3200 Specifications

Metrology type Dual-head micro-spot EDXRF and optical inspection (2D-3D)
Wafer size Up to 300 mm
Wafer type Blanket and patterned wafers
Navigation Precise stage complemented with an image recognition algorithm
Sub-micron fast navigation to single feature center
Micro XRF beam orientation Vertical incidence micro-spot (µXRF)
Optics "Polychromatic” (X-ray optics) and COLORS “Monochromatic” (X-ray optics)
Micro XRF beam spot size 10-50 µm spot sizes adjustable
Detector type Silicon drift detector (SDD): 3 configurations
  1. Regular > Al
  2. Light-element: C, N, O, F, S
  3. Heavy-element: > Ge (optimized for Ag, Sn)
DPP | Digital Pulse Processor High efficiency of more than 1 million photons/sec.
X/Y stage accuracy 0.1 µm

ONYX 3200 Events

Learn more about our products at these events

  • Rigaku Taiwan professional training courses (XRD)
    January 23 2026 - January 23 2026
    Rigaku Taiwan (RTC-TW)
  • Rigaku School for Practical Crystallography
    January 26 2026 - February 6 2026
  • SEMICON Korea 2026
    February 11 2026 - February 13 2026
    COEX, South Korea
  • SPIE Advanced Lithography + Patterning
    February 22 2026 - February 26 2026
    San Jose, CA, USA 
  • Florida Semiconductor Summit
    February 23 2026 - February 25 2026
    Orlando, FL, USA
  • Rigaku Taiwan professional training courses (SCX)
    February 26 2026 - February 26 2026
    Rigaku Taiwan (RTC-TW)
  • Applied Physics Society Autumn Nagoya
    March 15 2026 - March 16 2026
    Tokyo, Japan
  • The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum Sponsors
    March 16 2026 - March 19 2026
     Monterey, CA ,USA
  • SEMICON China 2026
    March 25 2026 - March 27 2026
    SNIEC, Shanghai, China
  • Rigaku Taiwan professional training courses (XRD)
    March 27 2026 - March 27 2026
    Rigaku Taiwan (RTC-TW)
  • CS International 2026
    April 20 2026 - April 22 2026
    Brussels, Belgium
  • SEMICON SEA 2026
    May 5 2026 - May 7 2026
    Kuala Lumpur, Malaysia
  • ASMC – Advanced Semiconductor Manufacturing Conference
    May 11 2026 - May 14 2026
    Albany, NY, USA
  • The 2026 IEEE 76th Electronic Components and Technology Conference
    May 26 2026 - May 29 2026
    Orlando, Fl, USA
  • CEIA Leti Innovation Days
    June 23 2026 - June 25 2026
    Maison Minatec, Grenoble, France 
  • The International Workshop on Gallium Oxide and Related Materials (IWGO-6)
    August 2 2026 - August 7 2026
     College Park, MD, USA.
  • SEMICON Taiwan 2026
    September 2 2026 - September 4 2026
    Taipei, Taiwan
  • ICSCRM Japan 2026 (Silver Sponsor)
    September 27 2026 - October 2 2026
    Yokohama, Japan
  • SEMICON West 2026
    October 13 2026 - October 15 2026
    San Francisco, CA, USA 
  • SEMICON Europa
    November 10 2026 - November 13 2026
    Munich, Germany
  • SEMICON Japan 2026
    December 9 2026 - December 11 2026
    Tokyo, Japan

Contact Us

Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.