ONYX 3000
Micro-spot EDXRF and Optical Inspection (2D-3D)
In-line non-destructive inspection and metrology for the semiconductor and micro-electronics industries
Combining advanced X-ray and optical techniques, the ONYX 3000 offers a unique wafer metrology approach in many areas from FEOL through WLP, leading to in-line solutions for these processes. This sophisticated hybrid metrology tool enables high-throughput, in-line measurements on a blanket and product wafers ranging from ultra-thin single-layer films to multi-layer stacks.
ONYX 3000 Overview
The optical feature with 2D microscope and 3D scanner enables defect detection, sizing, and characterization of BEOL structures through image analysis (of critical dimensions, height, roughness, etc. of metal stacks, solder bumps, pillars, etc.) complemented by elemental composition and thickness measurements by EDXRF analysis.
Hybrid configuration | automated X-ray analysis, 3D scanning, and 2D microscope for film stack, bumps and composition measurements on blanket and patterned wafers
Layer-by-layer wafer inspection with qualitative and quantitative results
- XRF measures elemental composition and film thickness
- 2D Microscope used for pattern recognition, CD calculation.
- 3D Scanner height measurement, area scan, wafer surface roughness and bumps co-planarity
ONXY 3000 unique advantages
- Optimal configuration for bumps inspection
- Array of 4 silicon drift detectors (SDD) with large active area and 123 eV FWHM (@5.9 keV) resolution
- Measures light (low-energy) elements (carbon, oxygen, magnesium, aluminum, and phosphorous) using an optional helium atmosphere and special SDD detectors
- Monochromatic or polychromatic X-ray options
- Inspects micro-features through focused vertical X-ray beam (down to 10 µm diameter for polychromatic optics and 20 µm diameter for monochromatic optics)
- Advanced motion platform for sub-micron accuracy
- Precise 3D geometrical inspection of features: micro-bumps, pillars, and pads
- Composition analysis associated with FinFET structures
- Fully automated calibration processes, ensuring long-term stability and consistency, and tube aging correction
- In line with SECS/GEM communication protocols
X-ray optics options
Polycapillary X-ray optics |
Monochromatic COLORS-t X-ray optics |
| Provide polychromatic and enhanced performance of XRF analysis to identify a wide range of elements efficiently |
Enables measurements in low background spectrum enabling effective analysis of low signals.
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ONYX 3000 Features
Hybrid configuration | automated x-ray analysis, 3D scanning, and 2D microscope for film thickness and composition measurements on blanket and patterned wafers.
2D Microscope |
2D Microscope Magnification |
3D Scanner |
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ONYX 3000 Videos
ONYX 3000 Specifications
| System Parameters | Specifications | |
|---|---|---|
| Metrology type | Micro-spot EDXRF and optical inspection (2D-3D) | |
| Wafer size | Up to 300 mm | |
| Wafer type | Blanket and patterned wafers | |
| X/Y stage resolution | < 1 µm (Stage resolution 0.1 µm) | |
| Sample handling | Magazine robot | |
| Automation | Full wafer capability with single or dual automatic loader | |
| Navigation | Precise stage complemented with an image recognition algorithm. Sub-micron fast navigation to single feature center. |
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| SW User Interface | Auto calibration. Ease-of-use recipe creation and maintenance. Fundamental parameters optional. | |
| Micro XRF beam orientation | Vertical incidence micro-spot µXRF | |
| X-ray tube energy | Up to 50 kV, 50 W | |
| Optics | Polycapillary / COLORS (monochromatic X-ray optics) |
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| Micro XRF beam spot size | 10-50 µm spot sizes adjustable | |
| Detector type | Silicon drift detector (SDD) optional: light element detector (C,N,O,F.S) | |
| Detector resolution | 123 ± 5 eV with a large solid angle | |
| DPP | Digital Pulse Processor | High efficiency of more than 1 million photons/sec | |
ONYX 3000 Application Notes
The following application notes are relevant to this product
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RSMD007 - Single Wafer Pass Detection & Metrology
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RSMD004 - Pd Measurement on GaAs Wafer
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RSMD-20104496 - Defect Sizing and Identification using 3D and XRF Review
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RSMD-20101833 - Aluminum Oxide Film Thickness Measurement
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RSMD-20220728 - Measurements of AgSn Micro Solder Bump using Monochromatic Micro X-ray Beam
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RSMD-20101936 - Cu Seed Composition and Thickness
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RSMD-20101835 - Ultrathin Film Thickness
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RSMD-20101831 - Ultrathin Ru Thickness Measurement by Micro-spot EDXRF
ONYX 3000 Events
Learn more about our products at these events
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EventDatesLocationEvent website
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Rigaku Taiwan professional training courses (XRD)January 23 2026 - January 23 2026Rigaku Taiwan (RTC-TW)
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Rigaku School for Practical CrystallographyJanuary 26 2026 - February 6 2026
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SEMICON Korea 2026February 11 2026 - February 13 2026COEX, South Korea
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SPIE Advanced Lithography + PatterningFebruary 22 2026 - February 26 2026San Jose, CA, USA
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Florida Semiconductor SummitFebruary 23 2026 - February 25 2026Orlando, FL, USA
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Rigaku Taiwan professional training courses (SCX)February 26 2026 - February 26 2026Rigaku Taiwan (RTC-TW)
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Applied Physics Society Autumn NagoyaMarch 15 2026 - March 16 2026Tokyo, Japan
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The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum SponsorsMarch 16 2026 - March 19 2026Monterey, CA ,USA
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SEMICON China 2026March 25 2026 - March 27 2026SNIEC, Shanghai, China
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Rigaku Taiwan professional training courses (XRD)March 27 2026 - March 27 2026Rigaku Taiwan (RTC-TW)
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CS International 2026April 20 2026 - April 22 2026Brussels, Belgium
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SEMICON SEA 2026May 5 2026 - May 7 2026Kuala Lumpur, Malaysia
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ASMC – Advanced Semiconductor Manufacturing ConferenceMay 11 2026 - May 14 2026Albany, NY, USA
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The 2026 IEEE 76th Electronic Components and Technology ConferenceMay 26 2026 - May 29 2026Orlando, Fl, USA
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CEIA Leti Innovation DaysJune 23 2026 - June 25 2026Maison Minatec, Grenoble, France
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The International Workshop on Gallium Oxide and Related Materials (IWGO-6)August 2 2026 - August 7 2026College Park, MD, USA.
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SEMICON Taiwan 2026September 2 2026 - September 4 2026Taipei, Taiwan
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ICSCRM Japan 2026 (Silver Sponsor)September 27 2026 - October 2 2026Yokohama, Japan
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SEMICON West 2026October 13 2026 - October 15 2026San Francisco, CA, USA
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SEMICON EuropaNovember 10 2026 - November 13 2026Munich, Germany
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SEMICON Japan 2026December 9 2026 - December 11 2026Tokyo, Japan
ONYX 3000
Contact Us
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