ONYX 3000

Micro-spot EDXRF and Optical Inspection (2D-3D)

In-line non-destructive inspection and metrology for the semiconductor and micro-electronics industries

Combining advanced X-ray and optical techniques, the ONYX 3000 offers a unique wafer metrology approach in many areas from FEOL through WLP, leading to in-line solutions for these processes. This sophisticated hybrid metrology tool enables high-throughput, in-line measurements on a blanket and product wafers ranging from ultra-thin single-layer films to multi-layer stacks.

ONYX 3000 Overview

The optical feature with 2D microscope and 3D scanner enables defect detection, sizing, and characterization of BEOL structures through image analysis (of critical dimensions, height, roughness, etc. of metal stacks, solder bumps, pillars, etc.) complemented by elemental composition and thickness measurements by EDXRF analysis.

Hybrid configuration | automated X-ray analysis, 3D scanning, and 2D microscope for film stack, bumps and composition measurements on blanket and patterned wafers

Layer-by-layer wafer inspection with qualitative and quantitative results

  • XRF measures elemental composition and film thickness
  • 2D Microscope used for pattern recognition, CD calculation.
  • 3D Scanner height measurement, area scan, wafer surface roughness and bumps co-planarity

ONXY 3000 unique advantages

  • Optimal configuration for bumps inspection
  • Array of 4 silicon drift detectors (SDD) with large active area and 123 eV FWHM (@5.9 keV) resolution
  • Measures light (low-energy) elements (carbon, oxygen, magnesium, aluminum, and phosphorous) using an optional helium atmosphere and special SDD detectors
  • Monochromatic or polychromatic X-ray options
  • Inspects micro-features through focused vertical X-ray beam (down to 10 µm diameter for polychromatic optics and 20 µm diameter for monochromatic optics)
  • Advanced motion platform for sub-micron accuracy
  • Precise 3D geometrical inspection of features: micro-bumps, pillars, and pads
  • Composition analysis associated with FinFET structures
  • Fully automated calibration processes, ensuring long-term stability and consistency, and tube aging correction
  • In line with SECS/GEM communication protocols

X-ray optics options

Polycapillary X-ray optics
Monochromatic COLORS-t X-ray optics
Provide polychromatic and enhanced performance of XRF analysis to identify a wide range of elements efficiently

Enables measurements in low background spectrum enabling effective analysis of low signals.

  • High brightness excitation
  • Small spots for a wide range of thin film applications.
  • Ideal configuration for bumps and copper pillars inspection


ONYX 3000 Features

Hybrid configuration | automated x-ray analysis, 3D scanning, and 2D microscope for film thickness and composition measurements on blanket and patterned wafers.
2D Microscope
2D Microscope Magnification
 3D Scanner

3d scanner features

2d microscope magnification

2d microscope features-1



Non-destructive analysis
Rapid data collection
High sensitivity to surface contamination
High Throughput
High Precision
Mapping analysis
Thickness and Composition Analysis
For up to 300 mm wafers
Available for 150 mm and 200 mm

ONYX 3000 Videos

ONYX 3000 Specifications

System Parameters Specifications
Metrology type Micro-spot EDXRF and optical inspection (2D-3D)
Wafer size Up to 300 mm
Wafer type Blanket and patterned wafers
X/Y stage resolution < 1 µm (Stage resolution 0.1 µm)
Sample handling Magazine robot
Automation Full wafer capability with single or dual automatic loader
Navigation Precise stage complemented with an image recognition algorithm.
Sub-micron fast navigation to single feature center.
SW User Interface Auto calibration. Ease-of-use recipe creation and maintenance. Fundamental parameters optional.
Micro XRF beam orientation Vertical incidence micro-spot µXRF
X-ray tube energy Up to 50 kV, 50 W
Optics Polycapillary / COLORS
(monochromatic X-ray optics)
Micro XRF beam spot size 10-50 µm spot sizes adjustable
Detector type Silicon drift detector (SDD) optional: light element detector (C,N,O,F.S)
Detector resolution 123 ± 5 eV with a large solid angle
DPP | Digital Pulse Processor High efficiency of more than 1 million photons/sec

ONYX 3000 Application Notes

The following application notes are relevant to this product

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