XHEMIS TX-3000V
VPD-Integrated Total Reflection X-ray Fluorescence System
Ultrahigh-speed metal contamination mapping and ultrahigh sensitivity analysis
Next-generation TXRF system compatible with wafers up to 300 mm in diameter
Total Reflection X-ray fluorescence (TXRF) is widely utilized in semiconductor manufacturing processes—such as cleaning, lithography, etching, and thin film deposition—for the high-sensitivity detection of metallic contamination.
XHEMIS TX-3000V Overview
The XHEMIS TX-3000V is a state-of-the-art TXRF system equipped with a multi-element detector capable of simultaneously analyzing three locations, in addition to the conventional single-target, triple-beam configuration. This enables high-throughput analysis and allows for high-sensitivity detection of elements ranging from Na to U.
The system also features a fully integrated and automated Vapor Phase Decomposition (VPD) function, enabling ultra-high sensitivity analysis through sample concentration. Furthermore, its hydrophilic VPD capability allows for effective VPD-TXRF measurements on substrates such as silicon carbide (SiC), expanding its applicability to a wider range of advanced materials.
Detection Limit of typical elements (LLD）
| Detection limit LLD (E10 atoms/cm²) | Al | Fe | Ni | Cu |
| TXRF | 25 | 0.1 | 0.1 | 0.15 |
| VPD-TXRF | 0.1 | 0.001 | 0.001 | 0.002 |
Measurement time: 1000 sec
XHEMIS TX-3000V Features
XHEMIS TX-3000V Specifications
| Technique | Total reflection X-ray fluorescence (TXRF) with vapor phase decomposition (VPD) | |
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| Benefit | Measurement of ultratrace elemental surface contamination 1E7 atoms/cm² detection limits ~ 3x improvement in mapping speed |
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| Technology | Integrated, automated VPD preparation, three-beam excitation, and automatic optics exchange | |
| Attributes | Three-detector configuration High-power W-anode X-ray source (9 kW rotating anode) Three excitation energies optimized for light, transition, and heavy elements XYθ sample stage Dual FOUP load ports |
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| Features | Full wafer mapping (SWEEPING-TXRF) Zero edge exclusion (ZEE-TXRF) Integrated, automated VPD pre-processing for Si wafers (VPD-TXRF) for highest sensitivity Dual FOUP load ports |
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| Options | Backside analysis (BAC-TXRF) GEM300 software, E84/OHT support Vapor Phase Treatment (VPT-TXRF) for enhanced sensitivity while retaining spatial info VPD for hydrophilic wafer surfaces (e.g., SiC) |
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| Dimensions | 1280 (W) x 3750 (D) x 2040 (H) (Excluding monitor and signal tower) |
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| Measurement results | Quantitative result, spectrum chart, color contour map, mapping table | |
XHEMIS TX-3000V Application Notes
The following application notes are relevant to this product
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RSMD001 - Evaluation Of Wet Cleans In SiC Power MOSFET Fabrication By TXRF
XHEMIS TX-3000V Resources
Webinars
| Total Reflection X-ray Fluorescence (TXRF) for Semiconductor Manufacturing | Watch the Recording |
Rigaku Journal articles
| Machine learning and application to spectral analysis on TXRF spectrometry | Watch the Recording |
XHEMIS TX-3000V Events
Learn more about our products at these events
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EventDatesLocationEvent website
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JSAP Autumn EXPOSeptember 6 2025 - September 9 2025Nagoya, Japan
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The 86th JSAP Autumn Meeting 2025September 6 2025 - September 9 2025Tokyo, Japan
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SEMICON TaiwanSeptember 9 2025 - September 11 2025Taipei, Taiwan
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EMRS Fall meeting 2025September 14 2025 - September 17 2025Warsaw, Poland
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International Conference on Silicon Carbide and Related Materials (ICSCRM 2025)September 15 2025 - September 18 2025Busan, Korea
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SEMICON JapanDecember 1 2025 - December 2 2025Tokyo, Japan
Contact Us
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