ONYX Series
Hybrid energy dispersive X-ray fluorescence and optical techniques
Typically for characterization of multilayered samples for BEOL and packaging applications. The instruments combine micro-spot EDXRF, 2D microscope, and 3D scanner for in-line, non-destructive inspection and metrology.
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ONYX 3000
EDXRF and optical hybrid metrology tool for automated X-ray analysis, 3D scanning, and 2D microscope for film thickness and composition measurements on blanket and patterned wafers for up to 300 mm wafers
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EDXRF and optical hybrid metrology tool for automated X-ray analysis, 3D scanning, and 2D microscope for film thickness and composition measurements on blanket and patterned wafers for up to 300 mm wafers
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