FSAS III
Automated crystalline orientation measurement system
For SiC, graphite, GaN, Si, Ge, GaAs, LN, LT, sapphire, etc.
From production to quality control of single crystal materials, X-ray diffraction systems for single crystal orientation and quality assurance.
FSAS III Overview
After measuring the orientation of various single crystal materials such as Si, Ge, GaAs, SiC, quartz, LN, LT, sapphire, rutile and fluorite accurately, the FSAS III transmits the angle cutting information to the cutter (for instance, to a wire saw). The orientation verification measurement of single crystals after cutting can also be carried out automatically. No special skills are required by the operator.
FSAS III Features
Even a novice can handle automatic determination of the cutting orientation of various single crystal materials. (Note: Depending on the sample shape, cutting method and cutter type, there may be a need to make a custom sample holder.)
Once the measuring conditions are stored in the FSAS III using a touch panel interface, the operator only has to click “Measurement Start” to conduct the automatic measurement. The measurement result will then be displayed on the screen while a hard copy is being generated.
The cut angle of a block or wafer sample can be automatically verified after cutting.
X-ray measurement and optical system alignment are automated to ensure reliable measurements
Special design consideration is given to safety, so the sample insertion door will be locked instantly at the start of a measurement. Access to the sample is provided at the end of the measurement.
The FSAS III is designed so that generated X-ray are fully confined to the system interior.
FSAS III Specifications
| Technique | X-ray diffraction (XRD) | |
|---|---|---|
| Technology | X-ray diffraction system for single-crystal orientation measurement of ingot and wafer | |
| Benefit | Automatic determination of the cutting orientation of various single crystal materials. | |
| Attributes | Automated X-ray and optical measurement system Safety-centered design Measuring conditions library |
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| Features | Custom sample holders optional to fit sample shape, cutting method and cutter type Verification of cut angle of a block or wafer sample after cutting Touch panel interface, one- click to conduct the automatic measurement Auto-lock function to protect the sample integrity and the measurement accurate results |
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| Dimensions | 1300 (W) x 845 (D) x 1600 (H) mm (Excluding the status lamp and X-ray warning lamp) |
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| Measurement results | Get the angular deviation on a lattice plane relative to a wafer. Angular deviation of a lattice plane relative to an orientation flat (OF) of a wafer |
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FSAS III Events
Learn more about our products at these events
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EventDatesLocationEvent website
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Rigaku School for Practical CrystallographyJanuary 26 2026 - February 6 2026
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SEMICON Korea 2026February 11 2026 - February 13 2026COEX, South Korea
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SPIE Advanced Lithography + PatterningFebruary 22 2026 - February 26 2026San Jose, CA, USA
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Florida Semiconductor SummitFebruary 23 2026 - February 25 2026Orlando, FL, USA
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Rigaku Taiwan professional training courses (SCX)February 26 2026 - February 26 2026Rigaku Taiwan (RTC-TW)
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Applied Physics Society Autumn NagoyaMarch 15 2026 - March 16 2026Tokyo, Japan
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The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum SponsorsMarch 16 2026 - March 19 2026Monterey, CA ,USA
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SEMICON China 2026March 25 2026 - March 27 2026SNIEC, Shanghai, China
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Rigaku Taiwan professional training courses (XRD)March 27 2026 - March 27 2026Rigaku Taiwan (RTC-TW)
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CS International 2026April 20 2026 - April 22 2026Brussels, Belgium
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SEMICON SEA 2026May 5 2026 - May 7 2026Kuala Lumpur, Malaysia
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ASMC – Advanced Semiconductor Manufacturing ConferenceMay 11 2026 - May 14 2026Albany, NY, USA
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WOCSDICE/EXMATEC 2026May 24 2026 - May 28 2026Gdańsk, Poland
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The 2026 IEEE 76th Electronic Components and Technology ConferenceMay 26 2026 - May 29 2026Orlando, Fl, USA
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CEIA Leti Innovation DaysJune 23 2026 - June 25 2026Maison Minatec, Grenoble, France
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The International Workshop on Gallium Oxide and Related Materials (IWGO-6)August 2 2026 - August 7 2026College Park, MD, USA.
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SEMICON Taiwan 2026September 2 2026 - September 4 2026Taipei, Taiwan
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ICSCRM Japan 2026 (Silver Sponsor)September 27 2026 - October 2 2026Yokohama, Japan
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SEMICON West 2026October 13 2026 - October 15 2026San Francisco, CA, USA
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SEMICON EuropaNovember 10 2026 - November 13 2026Munich, Germany
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SEMICON Japan 2026December 9 2026 - December 11 2026Tokyo, Japan
FSAS III
Contact Us
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