FSAS III
Automated crystalline orientation measurement system
For SiC, graphite, GaN, Si, Ge, GaAs, LN, LT, sapphire, etc.
From production to quality control of single crystal materials, X-ray diffraction systems for single crystal orientation and quality assurance.
FSAS III Overview
After measuring the orientation of various single crystal materials such as Si, Ge, GaAs, SiC, quartz, LN, LT, sapphire, rutile and fluorite accurately, the FSAS III transmits the angle cutting information to the cutter (for instance, to a wire saw). The orientation verification measurement of single crystals after cutting can also be carried out automatically. No special skills are required by the operator.
FSAS III Features
Even a novice can handle automatic determination of the cutting orientation of various single crystal materials. (Note: Depending on the sample shape, cutting method and cutter type, there may be a need to make a custom sample holder.)
Once the measuring conditions are stored in the FSAS III using a touch panel interface, the operator only has to click “Measurement Start” to conduct the automatic measurement. The measurement result will then be displayed on the screen while a hard copy is being generated.
The cut angle of a block or wafer sample can be automatically verified after cutting.
X-ray measurement and optical system alignment are automated to ensure reliable measurements
Special design consideration is given to safety, so the sample insertion door will be locked instantly at the start of a measurement. Access to the sample is provided at the end of the measurement.
The FSAS III is designed so that generated X-ray are fully confined to the system interior.
FSAS III Specifications
| Technique | X-ray diffraction (XRD) | |
|---|---|---|
| Technology | X-ray diffraction system for single-crystal orientation measurement of ingot and wafer | |
| Benefit | Automatic determination of the cutting orientation of various single crystal materials. | |
| Attributes | Automated X-ray and optical measurement system Safety-centered design Measuring conditions library |
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| Features | Custom sample holders optional to fit sample shape, cutting method and cutter type Verification of cut angle of a block or wafer sample after cutting Touch panel interface, one- click to conduct the automatic measurement Auto-lock function to protect the sample integrity and the measurement accurate results |
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| Dimensions | 1300 (W) x 845 (D) x 1600 (H) mm (Excluding the status lamp and X-ray warning lamp) |
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| Measurement results | Get the angular deviation on a lattice plane relative to a wafer. Angular deviation of a lattice plane relative to an orientation flat (OF) of a wafer |
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FSAS III Events
Learn more about our products at these events
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EventDatesLocationEvent website
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SEMICON SEAMay 19 2025 - May 21 2025Singapore
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EMRS Spring Meeting 2025May 25 2025 - May 29 2025Strasbourg, France
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Leti Innovation Days 2025June 24 2025 - June 26 2025Grenoble, France
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SOFC-XIXJuly 12 2025 - July 17 2025Stockholm, Sweden
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JSAP Autumn EXPOSeptember 6 2025 - September 9 2025Nagoya, Japan
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The 86th JSAP Autumn Meeting 2025September 6 2025 - September 9 2025Tokyo, Japan
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SEMICON TaiwanSeptember 9 2025 - September 11 2025Taipei, Taiwan
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EMRS Fall meeting 2025September 14 2025 - September 17 2025Warsaw, Poland
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International Conference on Silicon Carbide and Related Materials (ICSCRM 2025)September 15 2025 - September 18 2025Busan, Korea
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SEMICON JapanDecember 1 2025 - December 2 2025Tokyo, Japan
Contact Us
Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.