FSAS II
Automatic wafer crystal plane orientation measurement X-ray system FSAS II
Automatically measures the cutting angle, OF and notch position of the main surface of the wafer
FSAS II Features
The cut angle of the wafer surface plane and OF/notch position are automatically measured.
The sample is held by a vacuum chuck
Automatic scanning is made for each planar rotation position at 0, 90, 180 and 270° and the peak position is detected at each position
With the wafer physical cut plane as reference, calculations and output of the deflection angle of the crystal axis are made in the X and Y directions
When a specific attachment is added, OF/notch measurement can also be carried out.
Operation is made using a touch-panel
Measurement errors caused by operator can be eliminated thanks to automatic measurement and calculation
FSAS II Specifications
FSAS II Resources
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