FSAS II
Automatic wafer crystal plane orientation measurement X-ray system FSAS II
Automatically measures the cutting angle, OF and notch position of the main surface of the wafer
FSAS II Features
The cut angle of the wafer surface plane and OF/notch position are automatically measured.
The sample is held by a vacuum chuck
Automatic scanning is made for each planar rotation position at 0, 90, 180 and 270° and the peak position is detected at each position
With the wafer physical cut plane as reference, calculations and output of the deflection angle of the crystal axis are made in the X and Y directions
When a specific attachment is added, OF/notch measurement can also be carried out.
Operation is made using a touch-panel
Measurement errors caused by operator can be eliminated thanks to automatic measurement and calculation
FSAS II Specifications
FSAS II Resources
FSAS II Events
Learn more about our products at these events
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EventDatesLocationEvent website
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SEMICON SEAMay 19 2025 - May 21 2025Singapore
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EMRS Spring Meeting 2025May 25 2025 - May 29 2025Strasbourg, France
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Leti Innovation Days 2025June 24 2025 - June 26 2025Grenoble, France
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SOFC-XIXJuly 12 2025 - July 17 2025Stockholm, Sweden
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JSAP Autumn EXPOSeptember 6 2025 - September 9 2025Nagoya, Japan
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The 86th JSAP Autumn Meeting 2025September 6 2025 - September 9 2025Tokyo, Japan
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SEMICON TaiwanSeptember 9 2025 - September 11 2025Taipei, Taiwan
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EMRS Fall meeting 2025September 14 2025 - September 17 2025Warsaw, Poland
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International Conference on Silicon Carbide and Related Materials (ICSCRM 2025)September 15 2025 - September 18 2025Busan, Korea
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SEMICON JapanDecember 1 2025 - December 2 2025Tokyo, Japan
Contact Us
Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.