XTRAIA MF-3000

XRR, EDXRF, and XRD Metrology Tool

For composition and thickness (EDXRF), thickness, density, and roughness (XRR) for unpatterned and patterned films for up to 300 mm wafers

For thin-film applications, precise measurements of small areas are obtained, and high brightness is achieved in localized spots.

The Rigaku XTRAIA MF-3000 (formerly MFM310) performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.

XTRAIA-MF-3000

XTRAIA MF-3000 Overview

Designed for high-volume manufacturing

The XTRAIA MF-3000 is designed with high-volume 200 mm and 300 mm manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and S2/S8 Compliance for semiconductor production clean room operation, compliance with GEM300/HSMS and factory automation standards, high-reliability machine performance and low power consumption and cost of ownership.

COLORS enabling technology

COLORS X-ray optics were developed by Rigaku for the XTRAIA MF-3000 to enable measurements from small areas. COLORS beam modules couple a variety of XRF excitation sources with optics and are optimized to provide high brightness in small spots for a variety of thin film applications. With its own X-ray optics business, Rigaku is well-positioned develop and manufacture X-ray sources for current and future market needs.

XTRAIA MF-3000 Features

Micro-spot X-ray beams and pattern recognition
High-throughput product-wafer measurements
Wide range of materials and applications
High-resolution and precision covering thicknesses from Ångstroms to microns
For 200 mm and 300 mm wafers
Available with 300 mm factory automation
Design based on SEMI S2 and SEMI S8

XTRAIA MF-3000 Videos

XTRAIA MF-3000 Specifications

Technique X-ray reflectometry (XRR), energy dispersive X-ray Fluorescence (EDXRF), X-ray diffraction (XRD)
Benefit High-throughput measurement of blanket and product wafers from ultra-thin films to micron-order films, applicable to a wide range of thickness and film types
Technology Process micro-spot XRR, EDXRF, and XRD
Attributes Blanket and patterned wafer metrology
Choice of monochromatic, micro-spot X-ray beam modules (COLORS)
Features Ultra-fast detector with up to 10⁸ dynamic range
Dual FOUP load ports
Options GEM300 software, E84/OHT support
Dimensions 1400 (W) x 2050 (H) x 3410 (D) mm
Measurement results EDXRF: Film thickness and composition
XRR:      Film thickness, density, and roughness

XTRAIA MF-3000 Events

Learn more about our products at these events

  • Rigaku School for Practical Crystallography
    January 26 2026 - February 6 2026
  • SEMICON Korea 2026
    February 11 2026 - February 13 2026
    COEX, South Korea
  • SPIE Advanced Lithography + Patterning
    February 22 2026 - February 26 2026
    San Jose, CA, USA 
  • Florida Semiconductor Summit
    February 23 2026 - February 25 2026
    Orlando, FL, USA
  • Rigaku Taiwan professional training courses (SCX)
    February 26 2026 - February 26 2026
    Rigaku Taiwan (RTC-TW)
  • Applied Physics Society Autumn Nagoya
    March 15 2026 - March 16 2026
    Tokyo, Japan
  • The 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) Platinum Sponsors
    March 16 2026 - March 19 2026
     Monterey, CA ,USA
  • SEMICON China 2026
    March 25 2026 - March 27 2026
    SNIEC, Shanghai, China
  • Rigaku Taiwan professional training courses (XRD)
    March 27 2026 - March 27 2026
    Rigaku Taiwan (RTC-TW)
  • CS International 2026
    April 20 2026 - April 22 2026
    Brussels, Belgium
  • SEMICON SEA 2026
    May 5 2026 - May 7 2026
    Kuala Lumpur, Malaysia
  • ASMC – Advanced Semiconductor Manufacturing Conference
    May 11 2026 - May 14 2026
    Albany, NY, USA
  • WOCSDICE/EXMATEC 2026
    May 24 2026 - May 28 2026
    Gdańsk, Poland
  • The 2026 IEEE 76th Electronic Components and Technology Conference
    May 26 2026 - May 29 2026
    Orlando, Fl, USA
  • CEIA Leti Innovation Days
    June 23 2026 - June 25 2026
    Maison Minatec, Grenoble, France 
  • The International Workshop on Gallium Oxide and Related Materials (IWGO-6)
    August 2 2026 - August 7 2026
     College Park, MD, USA.
  • SEMICON Taiwan 2026
    September 2 2026 - September 4 2026
    Taipei, Taiwan
  • ICSCRM Japan 2026 (Silver Sponsor)
    September 27 2026 - October 2 2026
    Yokohama, Japan
  • SEMICON West 2026
    October 13 2026 - October 15 2026
    San Francisco, CA, USA 
  • SEMICON Europa
    November 10 2026 - November 13 2026
    Munich, Germany
  • SEMICON Japan 2026
    December 9 2026 - December 11 2026
    Tokyo, Japan

Contact Us

Whether you are interested in getting a quote, want a demo, need technical support, or simply have a question, we're here to help.