Onyx 3000
Features
- Micro-spot X-ray beam and pattern recognition
- 2D- and 3D- optical characterization of device structures
- High-throughput, blanket- and product-wafer measurements
- Wide range of materials and applications
- High resolution and precision covering thicknesses from Ångstroms to microns
- Helium purged measurement environment for light-element sensitivity
- Configurable for 300mm and smaller wafers
- Design based on SEMI S2 and SEMI S8
Hybrid XRF and Optical metrology FAB tool
Thickness, composition, defect identification and sizing of films and structures on blanket and patterned wafers
Specifications
Product name | Onyx |
Technique | X-ray fluorescence and optical microscopy |
Benefit | Measure ultra-thin single-layer films to multi-layer stacks; Characterize BEOL and WLP structures |
Technology | Process micro-spot EDXRF and 2D-, 3D- optical microscopy |
Core attributes | Design based on SEMI S2 and SEMI S8, micro-spot polycapillary X-ray optics |
Core options | SECS/GEM communication software, COLORS beam modules |
Computer | Internal PC, MS Windows® OS |
Core dimensions | 1390 (W) x 2040 (H) x 2960 (D) mm |
Mass | ~1250 kg |
Power requirements | 1Ø, 208 VAC 50/60 Hz, 16A |