- Micro-spot X-ray beam and pattern recognition
- 2D- and 3D- optical characterization of device structures
- High-throughput, blanket- and product-wafer measurements
- Wide range of materials and applications
- High resolution and precision covering thicknesses from Ångstroms to microns
- Helium purged measurement environment for light-element sensitivity
- Configurable for 300mm and smaller wafers
- Design based on SEMI S2 and SEMI S8
Hybrid XRF and Optical metrology FAB tool
Thickness, composition, defect identification and sizing of films and structures on blanket and patterned wafers
Combining advanced X-ray and optical techniques, the Onyx offers unique metrology approaches in many areas from FEOL through WLP leading to in-line solutions for these processes. This sophisticated hybrid metrology tool makes it practical to perform high-throughput, in-line measurements on blanket and product wafers ranging from ultrathin single-layer films to multilayer stacks. 2D- and 3D- optical microscopy enables defect detection in and characterization of BEOL structures through image analysis (of color, height, roughness, etc. of metal stacks, solder bumps, pillars, etc.) complemented by elemental composition and thickness measurements by XRF analysis.
Designed for high-volume manufacturing
The Onyx is designed with high-volume manufacturing in mind: high-throughput thickness and composition measurements by XRF, rapid 2D- and 3D- optical inspection, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, S2/S8 compliance for semiconductor production clean room operation, SECS/GEM communication software, high-reliability machine performance and low power consumption and cost of ownership.
Polycapillary and COLORS™ enabling technology
The Onyx is offered with micro-spot, polycapillary X-ray optics and optionally with Rigaku’s monochromatic COLORS™ X-ray optics. COLORS beam modules couple a variety of XRF excitation sources with optics and are optimized to provide high brightness in small spots for a variety of thin film applications.
|Technique||X-ray fluorescence and optical microscopy|
|Benefit||Measure ultra-thin single-layer films to multi-layer stacks; Characterize BEOL and WLP structures|
|Technology||Process micro-spot EDXRF and 2D-, 3D- optical microscopy|
|Core attributes||Design based on SEMI S2 and SEMI S8, micro-spot polycapillary X-ray optics|
|Core options||SECS/GEM communication software, COLORS beam modules|
|Computer||Internal PC, MS Windows® OS|
|Core dimensions||1390 (W) x 2040 (H) x 2960 (D) mm|
|Power requirements||1Ø, 208 VAC 50/60 Hz, 16A|