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ONYX 3000

2D Microscope2D Microscope Features

2D Microscope Magnification2D Microscope Magnification

3D Scanner3D Scanner features


  • Optimal configuration for bumps inspection
  • Array of 4 silicon drift detectors (SDD) with large active area and 123 eV FWHM
    (@5.9 keV) resolution
  • Measures light (low-energy) elements (carbon, oxygen, magnesium, aluminum, and phosphorous) using an optional helium atmosphere and special SDD detectors
  • Monochromatic or polychromatic X-ray options
  • Inspects micro-features through focused vertical X-ray beam (down to 10 µm diameter for polychromatic optics and 20 µm diameter for monochromatic optics)
  • Advanced motion platform for sub-micron accuracy
  • Precise 3D geometrical inspection of features: micro-bumps, pillars, and pads
  • Composition analysis associated with FinFET structures
  • Fully automated calibration processes, ensuring long-term stability and consistency, and tube aging correction
  • In line with SECS/GEM communication protocols
Is wafer level packaging an issue for your semiconductor manufacturing process? Explore ONYX 3000

Bump Inspection System

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In-Line Non-Destructive Wafer Inspection And Metrology

Hybrid configuration | automated X-ray analysis, 3D scanning, and 2D microscope for film thickness and composition measurements on blanket and patterned wafers

Combining advanced X-ray and optical techniques, the ONYX 3000 offers a unique wafer metrology approach in many areas from FEOL through WLP, leading to in-line solutions for these processes. This sophisticated hybrid metrology tool enables high-throughput, in-line measurements on a blanket and product wafers ranging from ultra-thin single-layer films to multi-layer stacks.

The optical feature with 2D microscope and 3D scanner enables defect detection, sizing, and characterization of BEOL structures through image analysis (of critical dimensions, height, roughness, etc. of metal stacks, solder bumps, pillars, etc.) complemented by elemental composition and thickness measurements by EDXRF analysis.

Hybrid configuration | automated X-ray analysis, 3D scanning, and 2D microscope for film stack, bumps and composition measurements on blanket and patterned wafers
Layer-by-layer wafer inspection with qualitative and quantitative results

  • XRF measures elemental composition and film thickness
  • 2D Microscope used for pattern recognition, CD calculation.
  • 3D Scanner height measurement, area scan, wafer surface roughness and bumps co‑planarity

X-ray optics options

Polycapillary X-ray optics

Provide polychromatic and enhanced performance of XRF analysis to identify a wide range of elements efficiently

Monochromatic  COLORS™-t X-ray optics

Enable measurements in low background spectrum enabling effective analysis of low signals.

  • High brightness excitation
  • Small spots for a wide range of thin film applications.
  • Ideal configuration for bumps and copper pillars inspection
Product Name ONYX 3000
Metrology Type Micro-spot EDXRF and optical inspection (2D-3D)
Benefit Measure ultra-thin single-layer films to multi-layer stacks; Characterize BEOL and WLP structures
Technology Hybrid configuration | Automated X-ray analysis, 3D scanning, and 2D microscope
Core attributes
  •     XRF measures elemental composition and film thickness
  •     2D Microscope used for pattern recognition, CD calculation.
  •     3D Scanner height measurement, area scan, wafer surface roughness and bumps co-planarity
Wafer Size Up to 300 mm
Wafer Type Blanket and patterned wafers
X/Y Stage Resolution < 1 µm (Stage resolution 0.1 µm)
Sample Handling Magazine robot
Automation Full wafer capability with single or dual automatic loader
Navigation Precise stage complemented with an image recognition algorithm. Sub-micron fast navigation to single feature center
SW User Interface Auto calibration. Ease-of-use recipe creation and maintenance. Fundamental parameters optional.
Micro XRF Beam Orientation Vertical incidence micro-spot XRF
X-ray tube energy Up to 50 kV, 50 W
Optics Polycapillary / COLORS™ (monochromatic X-ray optics)
Micro XRF beam Spot Size 10-50 µm spot sizes adjustable
Detector Type Silicon drift detector (SDD)
Optional: light element detector (C,N,O,F.S)
Detector Resolution 123 ± 5 eV with a large solid angle
DPP | Digital Pulse Processor High efficiency of more than 1 million photons/sec.
Computer Internal PC, MS Windows® OS
Core dimensions 1430 (W) x 3220 (D) x 2125 (H) mm
Mass 2600 kg approx.
Power requirements 208 VAC 3-phase 50/60 Hz 25 A
Single Bump Metrology

Single Bump Metrology

Measure and monitor Ag%, Sn%, Ni layers, Cu thickness, and total bump height:
  • Measure single-solder bumps as small as 10 μm diameter
  • Inspect a range of parameters: across the wafer, wafer-to-wafer, and lot-to-lot
  • Measure CD and a total height of single bumps using a 2D microscope, 3D scanner, and built-in sensors


Thin Films Measuring and Monitoring

Measure and monitor thickness and composition of precious metal thin films:
  • Analyze ultra-thin films of any type of element, regardless of their physical properties
Thin Film Measuring and Monitoring





Conduct metallurgical inspections of under bump metallization (UBM) and redistribution layers (RDL):
  • Analyze multi-stack structures and thick monolayers, for layer thickness and composition
  • Distinguish separate layers simultaneously



Alloy Compositions

Measure and monitor metals and alloy composition:
  • Analyze metal elements (Ga, P, Co, Ni, Fe, Pt, Cr, Zn, and Mn)
  • Identify alloys (NiFe, CoNi, NiP, NiPt, and CrMn)
Alloy compositions



Wafer metrology