AZX 400

Sequential Wavelength Dispersive XRF Spectrometer for Large Samples

Sequential wavelength dispersive XRF spectrometer offers analytical flexibility

Film thickness and composition measurements on wafers, media disks, coupons, sputtering targets Rigaku's unique AZX 400 sequential wavelength dispersive X-ray fluorescence (WDXRF) spectrometer can measure most elements in the periodic table (from Be to U), making it an ideal thin film evaluation tool for process R&D or in low-volume, high-product-mix environments. The AZX 400's unique ability to accept samples up to 400 mm diameter, 50 mm thick and 30 kg mass also enables composition analysis of sputtering targets, a key measurement capability for processes demanding tight composition control.

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AZX 400 Overview

XRF with customized sample adapter system

Having the versatility to adapt to your specific sample types and analysis needs, this WDXRF spectrometer is adaptable to various sample sizes and shapes using optional (made to order) adapter inserts. With a variable measurement spot (30 mm to 0.5 mm diameter, with 5-step automatic selection) and mapping capability with multi-point measurements to check for sample uniformity, this uniquely flexible instrument can dramatically streamline your quality control processes.

XRF with available camera and special lighting

Optional real-time camera allows the analysis area to be viewed within software. The operator has complete certainty as to what is being measured.

Traditional WDXRF analytical capabilities

All analytical capabilities of a traditional instrument are retained in this "large sample" variant. Analyze beryllium (Be) through uranium (U) with high-resolution, high-precision WDXRF spectroscopy, from solids to liquids and powders to thin films. Analyze wide composition ranges (ppm to tens of percent) and thicknesses (sub Å to mm). Optionally available is diffraction peak interference rejection, for optimal results for single-crystal substrates. Rigaku AZX 400 wavelength dispersive X-ray fluorescence (WDXRF) spectrometer complies with industry standards SEMI and CE.

AZX 400 applications

Sputtering target composition
Isolation films: SiO₂, BPSG, PSG, AsSG, Si₃N₄, SiOF, SiON, etc.
High-k and ferro-dielectric films: PZT, BST, SBT, Ta₂O₅, HfSiOx
Metal films: Al-Cu-Si, W, TiW, Co, TiN, TaN, Ta-Al, Ir, Pt, Ru, Au, Ni, etc.
Electrode films: doped poly-Si (dopant: B, N, O, P, As), amorphous-Si, WSix, Pt, etc.
Other doped films (As, P), trapped inert gas (Ne, Ar, Kr, etc.), C (DLC)
Ferroelectric thin films, FRAM, MRAM, GMR, TMR; PCM, GST, GeTe
Solder bump composition: SnAg, SnAgCuNi
MEMS: thickness and composition of ZnO, AlN, PZT
SAW device process: thickness and composition of AlN, ZnO, ZnS, SiO₂ (piezo film); Al, AlCu, AlSc, AlTi (electrode film)

AZX 400 accessories

Sample camera with special lighting allows the analysis point to be viewed on screen
Diffraction interference rejection provides accurate results for single-crystal substrates
Fundamental Parameters software for thin film analysis

AZX 400 Features

Large sample analysis

Up to 400 mm (diameter)
Up to 50 mm (thickness)
Up to 30 kg (mass)

Sample adapter system

Adaptable to various sample sizes

Measurement spot

30 mm to 0.5 mm diameter
5-step automatic selection

Mapping capability

Allows multipoint measurements

General purpose

Analyze Be - U
Elemental range: ppm to %
Thickness range: sub Å to mm

Diffraction interference rejection (option)

Accurate results for single-crystal substrates

Small footprint

50% footprint of the previous model

Compliance with industry standards

SEMI, CE marking

Sample view camera (option)

AZX 400 Specifications

Technique	Sequential wavelength dispersive X-ray fluorescence
Benefit	Flexibility to measure a variety of sample types, including 50 - 300 mm wafers, coupons, and sputtering targets (up to 30 kg)
Technology	Analytical flexibility to measure elements from Be to U Well-suited for process R&D and low-volume, high product mix environments
Attributes	4 kW sealed X-ray tube, sequential type goniometer, primary beam filter; measurement spot sizes 30, 20, 10, 1, and 0.5 mm (diameter)
Features	SQX (standardless analysis) software Measurements under vacuum enable light-element sensitivity Diffraction peak interference rejection
Options	Wafer loader Sample view camera
Dimensions	1376 (W) x 1710 (H) x 890 (D) mm
Measurement results	Film thickness and composition