Wafer Inspection and Metrology X-ray Metrology Techniques

TXRF | WDXRF | EDXRF | XRR | HRXRD | CDSAXS

Within the semiconductor industry, there is a continual demand for integrated circuits (IC) that exhibit higher performance at a lower cost than their predecessors. Wafer metrology tools are used to design and manufacture ICs by carefully controlling the film properties, line widths, and potential defect levels to optimize the manufacturing process of these devices. Metrology tools combined with wafer inspection capabilities can ensure that they target the physical and electrical properties of semiconductor devices under production. Wafer metrology can specifically identify surface particles, pattern flaws, and other conditions that could cause adverse effects on the performance of these devices.

Rigaku is a pioneer and world leader in designing and manufacturing X-ray-based measurement tools (X-ray diffraction, X-ray fluorescence, and X-ray reflectometry) to solve semiconductor manufacturing challenges. With about 30 years of global market leadership in the semiconductor industry, our families of products enable everything from in-fab process control metrology to R&D for thin film and materials characterization.

WAFER inspection and metrology X-ray metrology techniques

Setting the Industry Standards

Rigaku Semiconductor Metrology Division

Providing the most reliable solutions to aid your metrology issues and keep growing over the device generations, with the highest throughput and compelling cost of ownership.

Metrology Techniques

WDXRF

Wavelength Dispersive X-ray Fluorescence

TXRF

Total Reflection X-ray Fluorescence

XRR

X-ray Reflectometry

EDXRF

Energy Dispersive X-ray Fluorescence

CDSAXS

Critical-Dimension Small-Angle X-ray Scattering

HRXRD

High Resolution X-ray Diffraction

XRF

X-ray Fluorescence

XRD

X-ray Diffraction

1

Non-Destructive 3D Measurement Technology

2

Process Monitoring

3

Metrology Automation

4

Nanoscopic 3D Structures

5

Monitoring from lab to fab

6

Thin Film Characterization

7

Wafer Contamination Monitoring

8

Ultra-thin single-layer films to multi-layer stacks

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